New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
New Equipment | Rework & Repair Equipment
FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo
For placing and reworking mBGA, BGA and QFP devices: 1. Placement and reflow head in one position 2. Motorized Z-movement 3. Repeatable placement 4. Placement pressure control 5. Up to 35X magnification 6. Image splitter for simultaneous four s
Industry Directory | Consultant / Service Provider / Manufacturer
A Contract Manufacturing company specializing in Printed Circuit Board Assembly, Quick Turn Prototype Services, and Direct Fulfillment.
Ersa offers online demos on all rework systems. Fix your personal date via rework.info@kurtzersa.com or info@kurtzersa.de. Our Ersa experts will show you online how to operate the machines and how to solve your individual rework tasks. Ersa Rework ?
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
A to Z soldering products - Stencils, Printers, Pick&Place, Inspection, Reflow, Chemicals, Lead-Free, Cleaning, Rework, Crimping, Wire Stripping, Hand Soldering, Nano Soldering, Dry Cabinets, OEM, BGA
New Equipment | Rework & Repair Equipment
Factory Price Automatic Optical BGA Rework Station WDS-620 WhatsApp:+8615573072473 Skype:salesool-wisdomshow Business field Laptop and mother boards rework and repair. Game consoles applications rework and repair. Small and medium size elec
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry Directory | Manufacturer
New Age Technologies is a Electronic Manufacturing Services Provider in Business Since 1988
Career Center | Space Coast, Florida USA | Engineering,Research and Development
Board Level Assembly BGA Expert! We are in need of an Electronic Packaging or Advanced Manufacturing Engineer to work with the Advanced Manufacturing Technology Group of a major Florida based Communications company. Support IR&D and Program activit
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