Events Calendar | Wed May 15 00:00:00 EDT 2019 - Fri May 17 00:00:00 EDT 2019 | Seoul, South Korea
Electronics Manufacturing Korea - Korea's largest electronics manufacturing exhibition
New Equipment | Assembly Services
US Based PCB Assembly Contract Manufacturer Since 1987, AGILITY mfg has specialized in the assembly of printed circuit boards and the manufacture of electro-mechanical assemblies for electronic design facilities, engineering firms, and OEM's. We
Industry News | 2012-05-22 14:14:12.0
ACD,announced the purchase of a PDR IR-E3 Evolution 2000 BGA Rework System for ultimate performance in BGA rework.
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Equipment Broker - Used - SMT specialists - Quality Manufacturing Equipment Bought and Sold - Zevatech/Juki /MPM Specialists.
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Industry News | 2013-09-16 14:38:01.0
VJ Electronix, Inc. and BEST, Inc. announce that Don Naugler and Bob Wetterman will be presenting a paper during technical session SMT3 BGA Profiling and Reballing at the upcoming SMTA International in Fort Worth, TX.
Name: BGA Soldering desoldering Machine for motherboards repairing Condition: New Applicable Industries: Machinery Repair Shops, Manufacturing Plant, Retail, mobile phone assembly, Computer production and services, Repair shop, Electronic repair j
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
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