Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Industry News | 2016-08-29 18:40:48.0
Kurtz Ersa North America is pleased to announce that it will exhibit in Booth #1034 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope, i-CON VARIO 4 and Smartflow 2020.
Technical Library | 2022-10-11 20:15:14.0
The increased temperatures associated with Pb-free processes have produced significant challenges for PWB laminates. Newly developed laminates have different curing processes, are commonly filled with ceramic particles or micro-clays and can have higher Tg values. These changes which are aimed at improving the materials resistance to thermal excursions and maintaining electrical integrity through primary attach and rework operations have also had the effect of producing harder resin systems with lower fracture toughness.
New Equipment | Assembly Services
US Based PCB Assembly Contract Manufacturer Since 1987, AGILITY mfg has specialized in the assembly of printed circuit boards and the manufacture of electro-mechanical assemblies for electronic design facilities, engineering firms, and OEM's. We
Industry Directory | Consultant / Service Provider / Distributor / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Equipment Broker - Used - SMT specialists - Quality Manufacturing Equipment Bought and Sold - Zevatech/Juki /MPM Specialists.
Career Center | Melbourne, Florida USA | Engineering
Advanced Manufacturing Technology Position Description Job Description: AMT Engineer � Level 4 Support IR&D and Program activities Division wide working on the development, qualification, and implementation of electronic packaging technologies, wi
Name: BGA Soldering desoldering Machine for motherboards repairing Condition: New Applicable Industries: Machinery Repair Shops, Manufacturing Plant, Retail, mobile phone assembly, Computer production and services, Repair shop, Electronic repair j
New Equipment | Rework & Repair Equipment
20 X 20 in. (508 mm X 508 mm) Min. Component Size 0.005" (0.12mm) Placement 0.0005" (12μ) mean + 3σ Compliance CE, ANSI/UL 61010, CAN/CSA C22.2 Top Heater 2.0 kW Site Heater 1.0 kW Bottom Heater 5.6 kW Field-of-View 2.6" (65 mm) Square Carry
