This is an indepth video showing you how to rework a BGA using the PDR IR-E3 with CCTV/Split prism vision alignment rework station from our Evolution series. We call this system the E3Vi For further details on PDR Focused IR rework stations/systems
ENT-300 has been developed for small PCB Reworking that optimized for the Min 20*20mm to Max 310*370mm such as mobile phone, navigation. Price competitiveness has increased effectiveness when working with a small PCB by removing the expensive IR heat
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
Industry News | 2011-10-28 20:29:08.0
ERSA is pleased to offer a free ERSA Mobile Scope with the purchase of an ERSA rework system. The ERSA Mobile Scope is a new portable video microscope designed to inspect hidden solder joints of ball grid arrays (BGAs), μBGAs, chip scale packages (CSPs) and flip chips.
For placing and reworking mBGA, BGA and QFP devices: 1. Placement and reflow head in one position 2. Motorized Z-movement 3. Repeatable placement 4. Placement pressure control 5. Up to 35X magnification 6. Image splitter for simultaneous four s
Industry Directory | Consultant / Service Provider / Manufacturer
A Contract Manufacturing company specializing in Printed Circuit Board Assembly, Quick Turn Prototype Services, and Direct Fulfillment.
Ersa offers online demos on all rework systems. Fix your personal date via rework.info@kurtzersa.com or info@kurtzersa.de. Our Ersa experts will show you online how to operate the machines and how to solve your individual rework tasks. Ersa Rework ?
Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
A to Z soldering products - Stencils, Printers, Pick&Place, Inspection, Reflow, Chemicals, Lead-Free, Cleaning, Rework, Crimping, Wire Stripping, Hand Soldering, Nano Soldering, Dry Cabinets, OEM, BGA
Industry News | 2004-04-27 15:19:57.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1453, designed for BGA encapsulation. Removal of defective BGA's is easily accomplished by heating the component and the underfill encapsulant to 220°C. Underfill encapsulant residues are easily scraped or brushed off.
Industry Directory | Manufacturer
New Age Technologies is a Electronic Manufacturing Services Provider in Business Since 1988
