Industry Directory | Manufacturer
Since 1980, the Dr. Tresky AG company has been supplying the micro- and opto- electronics industry with innovative component placers and die bonders.
Industry News | 2017-08-14 19:16:34.0
Kurtz Ersa North America announces plans to exhibit in Booth #335 at SMTA International, scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, IL. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope and i-CON VARIO 4.
Technical Library | 2012-12-20 14:36:09.0
The increased function of personal electronic devices, such as mobile phones and personal music devices, has driven the need for smaller and smaller active and passive components. This trend toward miniaturization, occurring at the same time as the conversion to RoHS-compliant lead-free assembly, has been a considerable challenge to the electronics assembly industry. The main reason for this is the higher reflow process temperatures required for Pb-free assembly. These higher temperatures can thermally damage the PCB and the components. In addition, the higher reflow temperatures can negatively affect the solder joint quality, especially when coupled with the smaller paste deposits required for these smaller components. If additional thermal processing is required, the risk increases even more. First Published at SMTA's International Conference on Soldering and Reliability in Toronto, May 2011
- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking
Industry News | 2016-08-29 18:40:48.0
Kurtz Ersa North America is pleased to announce that it will exhibit in Booth #1034 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope, i-CON VARIO 4 and Smartflow 2020.
Industry News | 2011-04-20 16:31:45.0
Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.
Used SMT Equipment | In-Circuit Testers
8960 Series 10 Wireless Communications Test Set The Agilent E5515C hardware platform for the 8960 Series 10 wireless communication test set offers mobile manufacturers and wireless device developers immediate competitive advantages. The proven 89
Used SMT Equipment | In-Circuit Testers
Agilent E5515C-003-E1962B The Agilent E5515C hardware platform for the 8960 Series 10 wireless communication test set offers mobile manufacturers and wireless device developers immediate competitive advantages. The proven 8960 test applications
Used SMT Equipment | In-Circuit Testers
Agilent E5515C-003-E1962B The Agilent E5515C hardware platform for the 8960 Series 10 wireless communication test set offers mobile manufacturers and wireless device developers immediate competitive advantages. The proven 8960 test applications
Used SMT Equipment | In-Circuit Testers
Agilent E5515C-002-003-E1962B The Agilent E5515C hardware platform for the 8960 Series 10 wireless communication test set offers mobile manufacturers and wireless device developers immediate competitive advantages. The proven 8960 test applicat
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