Used SMT Equipment | General Purpose Test & Measurement
Agilent E5515C-002-003 The Agilent E5515C hardware platform for the 8960 Series 10 wireless communication test set offers mobile manufacturers and wireless device developers immediate competitive advantages. The proven 8960 test applications, d
Industry News | 2016-08-29 18:40:48.0
Kurtz Ersa North America is pleased to announce that it will exhibit in Booth #1034 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Ersa’s team will demonstrate the HR 550 Rework system, Ersa Mobile Scope, i-CON VARIO 4 and Smartflow 2020.
ScanINSPECT SPI provides a simple and user-friendly alternative to inaccurate and time-consuming manual inspection methods or expensive, high-end AOI systems. ScanINSPECT SPI uses a simple Windows user interface integrated with an automatic conveyo
Technical Library | 2014-05-12 09:24:11.0
With the advancement of the electronic industry, Package on package (POP) has become increasingly popular IC package for electronic devices, particularly in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far, no customer has reported using these methods or materials in their mass production. In order to address these issues for POP assembly, YINCAE has successfully developed a first individual solder joint encapsulant adhesive.
Technical Library | 2014-06-02 11:03:45.0
With the advancement of the electronic industry, package on package (POP) has become increasingly popular IC package for electronic devices, particularly POP TMV (Through Mold Vials) in mobile devices due to its benefits of miniaturization, design flexibility and cost efficiency. However, there are some issues that have been reported such as SIR drop due to small gap between top and bottom components, difficulty underfilling and rework due to stacked IC components and process yield issues. Some suppliers have reported using some methods such as dipping epoxy paste or epoxy flux to address these issues, but so far no customer has reported using these methods or materials in their mass production. In order to address these issues for POP TMV assembly, YINCAE has successfully developed and commercialized the first individual solder joint encapsulant adhesive for mass production for years.
Industry News | 2011-04-20 16:31:45.0
Finetech, a world leading equipment manufacturer of advanced rework solutions, will present two rework systems for professional rework applications in booth 2D10-A at NEPCON China 2011.
Industry Directory | Equipment Dealer / Broker / Auctions
Shenzhen Grandtop Automation Co., Ltd ,a manufacture specialized in SMT and DIP processing. products are widely used in industrial equipments,ommunication apparatus, automobile electronics, computers
Industry Directory | Consultant / Service Provider / Manufacturer
Lepla srl electronic contract manufacturer, specialized in the SMT & THT Electronic Cards Assembling, Wiring Assembling Harness, In-Circuit, Parametric and Functional Testing.
Systronix, Inc. is an industry leader in the supply of electronic manufacturing services. We provide a broad range of services to leading companies in industries that require high tech, high quality and highly reliable electronics.
Industry Directory | Manufacturer
New Age Technologies is a Electronic Manufacturing Services Provider in Business Since 1988
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