Industry Directory: mobile devices (25)

Motorola Mobility LLC.

Industry Directory | Other

Motorola Mobility makes Android smartphones and Bluetooth accessories to keep people connected.

Delkin Devices, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer

Delkin Devices, Inc. is an independently owned business and the largest US memory card manufacturer in San Diego, CA.

New SMT Equipment: mobile devices (303)

Spectrum II S2-900 Series Fluid Dispensers

Spectrum II S2-900 Series Fluid Dispensers

New Equipment | Dispensing

The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability

ASYMTEK Products | Nordson Electronics Solutions

Device Testing Services

New Equipment | Test Services

What if you could make your product better, get it to market faster, and save money? With QualityLogic as your partner, you can! We have over 16 years' experience in testing computers and peripheral devices, both in developing specialized test tools

QualityLogic

Electronics Forum: mobile devices (13)

Invisible Fast long distance Wireless Charger Shengshi ZeePower Charging distance up to 45mm

Electronics Forum | Tue Aug 06 23:17:24 EDT 2019 | zeepower

The Optimized Wireless Charging Product, a new powerful wireless charger that can be hidden under your desktop and charge your mobile devices directly through your desktop. ZeePower GK35001—— Its input is 19V / 2A, supporting a space charging distan

removing glued chips

Electronics Forum | Sun Jun 05 13:42:16 EDT 2005 | amigo

We find it impossible to remove the glued micro-BGA chips like the CPU and the UEM ICs used in Mobile Phones. They are both surface mount devices and glued with some chemicals we think. Any help is most needed in this matter.

Used SMT Equipment: mobile devices (54)

ASM Siemens SIPLACE HF-3 / A376-12031047

ASM Siemens SIPLACE HF-3 / A376-12031047

Used SMT Equipment | Pick and Place/Feeders

Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num

Qinyi Electronics Co.,Ltd

ASM Siemens ASM SIPLACE HF-3/A516-12033248

ASM Siemens ASM SIPLACE HF-3/A516-12033248

Used SMT Equipment | Pick and Place/Feeders

Siemens HF3, HF multi-function placement machine Siemens placement machine HF3 parameters: 1. Placement head type: dual placement heads and 12-nozzle collection and placement heads and/or 6-nozzle collection and placement heads and IC heads 2. Num

Qinyi Electronics Co.,Ltd

Industry News: mobile devices (444)

Nippon Mining Holdings to Increase Production Capacity for Rolled Copper Foil

Industry News | 2003-03-12 09:03:48.0

Demand for the material, used in PCBs, is increasing because of folding mobile phones and other devices

SMTnet

Online IPC Training & Certification from Blackfox

Industry News | 2020-04-02 14:42:58.0

Due to the ongoing COVID-19 pandemic, Blackfox is offering online IPC training and certification beginning in mid-April.

Blackfox Training Institute, LLC

Parts & Supplies: mobile devices (19)

Yamaha CL 8x2 Feeder(0201) copy new

Yamaha CL 8x2 Feeder(0201) copy new

Parts & Supplies | Pick and Place/Feeders

YAMAHA CL 8X2 device (0201) YAMAHA CL feeder series YAMAHA CL feeder Part Number: Yamaha CL 8 * 2 mm feeder 0201 KW1-M1500-030 Yamaha CL 8 th * 2 mm-M1400-00X KWl feeder 0402 . 8 Article Yamaha CL * 4 mm feeder KW1-M1100-000 Yamaha CL12

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Yamaha CL 8x2 Feeder(0402)copy new

Yamaha CL 8x2 Feeder(0402)copy new

Parts & Supplies | Pick and Place/Feeders

YAMAHA CL 8X2 device (0402) YAMAHA CL feeder series YAMAHA CL feeder Part Number: Yamaha CL 8 * 2 mm feeder 0201 KW1-M1500-030 Yamaha CL 8 th * 2 mm-M1400-00X KWl feeder 0402 . 8 Article Yamaha CL * 4 mm feeder KW1-M1100-000 Yamaha CL12 m

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Technical Library: mobile devices (20)

Throughput vs. Wet-Out Area Study for Package on Package (PoP) Underfill Dispensing

Technical Library | 2012-12-17 22:05:22.0

Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.

ASYMTEK Products | Nordson Electronics Solutions

Solving Surface-Mount Assembly Challenges Presented by 0201mm Components

Technical Library | 2021-09-01 15:26:46.0

The global electronics industry's ability to deliver seemingly limitless ongoing advancements in product capabilities has encouraged an insatiable consumer demand for more, better, and smaller. Demands for high functionality of mobile devices, smart watches, military, medical, audio, and wearable technology continue to drive requirements for miniaturisation.

Yamaha Motor IM America, Inc.

Videos: mobile devices (223)

The SC-350 is specifically optimized to atomize coating fluids – delivering exceptional edge definition.

The SC-350 is specifically optimized to atomize coating fluids – delivering exceptional edge definition.

Videos

The SC-350 is specifically optimized to atomize coating fluids – delivering exceptional edge definition. For more information, please visit our product page - http://www.nordson.com/en/divisions/asymtek/products/applicators/select-coat-applicator-se

ASYMTEK Products | Nordson Electronics Solutions

PCB Depaneling Router ML-CS818

PCB Depaneling Router ML-CS818

Videos

PCB Depaneling Router ML-CS818 This device is suitable for various small multi-connected PCB sub-boards such as mobile phones, tablet computers, automotive electronics, GPS, boards, etc. The enlarged size is suitable for the sub-board processing of

Qinyi Electronics Co.,Ltd

Training Courses: mobile devices (1)

Online IPC-A-610 Trainer (CIT) Training & Certification

Training Courses | ONLINE | | IPC-A-610 Trainer (CIT)

The Certified IPC-A-610 Trainer (CIT) courses recognize individuals as qualified trainers in the area of quality assurance of electrical and electronic assemblies and prepares them to deliver Certified IPC-A-610 (CIS) training.

Blackfox Training Institute, LLC

Events Calendar: mobile devices (7)

12 Essential Skills Every Engineer Needs To Learn Part 1

Events Calendar | Tue May 12 00:00:00 EDT 2020 - Tue May 12 00:00:00 EDT 2020 | ,

12 Essential Skills Every Engineer Needs To Learn Part 1

Surface Mount Technology Association (SMTA)

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Surface Mount Technology Association (SMTA)

Career Center - Jobs: mobile devices (7)

Western Region Field Service Engineer

Career Center | San Jose, California USA | Engineering,Technical Support

Attention 2-4 year tech school/engineering graduates with a willingness to learn and travel! We are looking for a field service engineer based in Phoenix, LA or San Jose area that will be responsible for installing, servicing and training customers o

Hesse Mechatronics

Semiconductor Process Engineer

Career Center | Rochester, New York USA | Engineering

Kodak ISS continues to experience significant growth. As part of Kodak's digital growth strategy, ISS develops, manufactures and markets imaging sensor devices that are a critical component in a broad range of imaging products including digital camer

Eastman Kodak Company

Career Center - Resumes: mobile devices (19)

B-TECH IN ECE

Career Center | RANCHI, JHARKHAND India | Engineering

(1)-TECHNICAL SKILLS • SURFACE MOUNT TECHNOLOGY for PCB assembly • Cellular Mobile Communication • Mobile switching • Electronics device and circuits. • PCB card testing (2)-TRAINING SKILLS- (A) Six months industrial training at Indian Telephon

SMT PRODUCTION ENGINEER

Career Center | Muzzaffarnagar, India | Production

Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process

Express Newsletter: mobile devices (406)

Partner Websites: mobile devices (4918)


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