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Projection Moiré vs. Shadow Moiré for Warpage Measurement and Failure Analysis of Advanced Packages

Technical Library | 2013-01-31 18:43:15.0

There are three key industry trends that are driving the need for temperature-dependent warpage measurement: the trend toward finer-pitch devices, the emergence of lead-free processing, and changes in device form factors. Warpage measurement has become a key measurement for analysis; prevention and prediction of interconnect defects and has been employed in failure analysis labs and production sites worldwide. First published in the 2012 IPC APEX EXPO technical conference proceedings

ZN Technologies

Warpage/Coplanarity Measurement Lab Services

Warpage/Coplanarity Measurement Lab Services

New Equipment | Inspection

ZN Technologies (www.zntechnologies.com) is proud to offer warpage/coplanarity measurement services to customers worldwide.  Using the most advanced moire technique available (projection moire), ZN can measure BGA, PCB and IC warpage, even during ref

ZN Technologies

Mirtec MS 11 3D SPI DEMO UNIT

Mirtec MS 11 3D SPI DEMO UNIT

Used SMT Equipment | X-Ray Inspection

R / Front Conveyor Type : Single Lane Max.PCB Size : 460 x 510mm 3D Method : Moire Center Camera : 4M Condition : very good / demo unit Weight: 900 kg Location: allSMT Germany

allSMT GmbH & Co KG

Koh Young Zenith Lite

Koh Young Zenith Lite

Used SMT Equipment | AOI / Automated Optical Inspection

Koh Young In-Line 3D AOI Vintage: 2013 Model: Zenith Lite 3D Automated Optical Inspection 4m Pixel High Speed Camera 20 Micron Camera Resolution 3D Shadow Free Moire Technology Complete & Operational

LEL Tech

Koh Young KY-8030-2

Koh Young KY-8030-2

Used SMT Equipment | SPI / Solder Paste Inspection

Koh Young In-Line 3D SPI Vintage: 2013 3D Solder Paste Inspection 5m Pixel Camera 3D Shadow Free Moire Technology 35 Micron Resolution Auto Conveyor Width Adjustment Complete & Operational

LEL Tech

3D XPI 5000L - In-Line SPI System

3D XPI 5000L - In-Line SPI System

New Equipment | Inspection

Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best

Synapse Imaging Co., Ltd.

Koh Young America, Inc.

Industry Directory | Consultant / Service Provider / Manufacturer / Other / Training Provider

Koh Young is the leading True3D™ measurement-based inspection solutions provider supported by its global offices to ensure close communication with a growing customer base to provide access to AI-powered process optimization tools

Marantz ISO-Spector M1 510L

Marantz ISO-Spector M1 510L

Used SMT Equipment | AOI / Automated Optical Inspection

INSTALLED November 2018! Looks and smells like new.   ISO-Spector M1 510L | Art Code: G300_510L AOI Machine Inline M1 AI TopographicIn-line Full 3D Artificial Intelligent AOI for up to 510x680mm (20x26") PCBs | Automatic solder joints inspection thro

KVMS SMT Equipment Services Supplies

Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1

Industry News | 2015-10-22 16:56:59.0

Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

Industry News | 2016-02-17 16:31:00.0

Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix


moire searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Voidless Reflow Soldering

Wave Soldering 101 Training Course
pressure curing ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
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World's Best Reflow Oven Customizable for Unique Applications


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