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Akrometrix LLC to Demonstrate Real-Time Analysis, Array Generation (wafer partitioning), and 2D/3D Interface Analysis Software at productronica, U.S. Pavilion Hall A3, Booth 112/1

Industry News | 2015-10-22 16:56:59.0

Akrometrix LLC will exhibit in Hall A3, Booth 112/1 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. Company representatives will exhibit Akrometric’s TherMoire’ AXP modular metrology platform which provides shadow moire’, digital fringe projection, and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Akrometrix LLC Will Discuss Thermal Warpage and Strain Metrology at APEX

Industry News | 2016-02-17 16:31:00.0

Akrometrix LLC will exhibit in Booth #1623 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. Company representatives will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. Akrometrix also will demonstrate its new Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

PAC Global to Discuss Thermal Warpage and Strain Metrology Solutions from Akrometrix at Upcoming SMTA Expos

Industry News | 2016-02-18 19:59:51.0

Akrometrix will exhibit at the SMTA Houston & Dallas Expo & Tech Forums in Texas. SMTA Houston is scheduled to take place Tuesday, March 1, 2016 at the Stafford Centre and SMTA Dallas is scheduled to take place Thursday, March 3, 2016 at the Plano Centre. The PAC Global team will discuss Akrometric’s TherMoire’ AXP modular metrology platform that provides shadow moire’, digital fringe projection and digital image correlation capabilities in one platform. PAC Global also will demonstrate the new Akrometrix Real-Time Analysis Software along with Array Generation Software (for thermal warpage measurement and partitioning of wafers) and Interface Analysis Software that allows high level and in-depth review of the attachment interface between two surfaces that warp during microelectronics and electronic assembly production reflow processes.

Akrometrix

Thermal Warpage and Strain Metrology Platforms will be Displayed at GOMACTech

Industry News | 2016-02-23 19:44:33.0

Akrometrix will exhibit in Booth #108 at the GOMACTech 2016 Conference, scheduled to take place March 14-17, 2016 in Orlando, Fl. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for government reviews.

Akrometrix

Koh Young KY8030-3 Solder Paste Inspection Machine (2011)

Koh Young KY8030-3 Solder Paste Inspection Machine (2011)

Used SMT Equipment | SPI / Solder Paste Inspection

Koh Young KY8030-3 3D Solder Paste Inspection Machine Brand: Koh Young Model: KY8030-3 Model Name: KY-8030-3L-4M15-3P Year: 2011 Serial #: SPI-83L275 Type: Solder Paste Inspection Machine Origin: Korea Drawing #: E-025/(E-023) CE Marked

Tekmart International Inc.

The Murray Percival Company to Support MIRTEC’s Award-Winning AOI at SMTAI

Industry News | 2019-08-27 23:34:56.0

Murray Percival will be available to demo the MIRTEC MV-6 OMNI 3D AOI machine at booth #305 at SMTA International. The all new MV-6 OMNI 3D AOI Machine combines MIRTEC’s exclusive 15 Mega Pixel CoaXPress Camera Technology with their proprietary OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology to provide precision inspection of SMT devices on finished PCB assemblies.

Murray Percival

TRI presents New High-Reliability 3D AOI Solution

Industry News | 2021-01-11 15:33:48.0

Test Research, Inc. (TRI) is pleased to announce the release of the high-reliability TR77000QM SII3D AOI.

TRI - Test Research, Inc. USA

New Gerber Layer Format Specification

Industry News | 2021-03-12 04:55:13.0

Ucamco has published a new revision of the Gerber Layer Format Specification.

Ucamco

TRI Receives the 2021 Global Technology Award for SPI Solution

Industry News | 2021-11-22 06:30:35.0

Test Research, Inc. announces that the company's 3D SPI system, TR7007QI Plus, received a 2021 Global Technology Award.

TRI - Test Research, Inc. USA

PPT VISION Commences Rights Offering of 5.5 Million Units to Existing Shareholders

Industry News | 2002-04-08 07:56:31.0

Each Shareholder is Granted the Right to Purchase One Unit for Every Share of Stock Owned as of the Record Date at a Price of $1.00 Per Unit

PPT Vision, Inc.


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