Electronics Forum | Thu Nov 19 14:41:19 EST 1998 | Susan mcbirdie
Hello Everybody I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more informatio
Electronics Forum | Mon Jul 27 13:41:56 EDT 1998 | Chris Fontaine
Steve, We do a lot of hand spray conformal coating and have had much success. We have had much experience with Humiseal 1A20 Urethane. Acrylics are easier to work with but may not stand up to your environment. I don't have any experience with sili
Electronics Forum | Tue Apr 02 22:58:10 EST 2002 | davef
Whatever I've said, my intent has never been to insult you. Smack you yes, insult you no. True, you never said the word �strings� but you did say � * �� shouldn't I be able to expect enough green strength from my epoxy to hold 0603 caps in place wi
Electronics Forum | Thu Oct 24 17:32:54 EDT 2002 | ksfacinelli
The big problem we saw was the appearance of the solder joint after the water wash process. We saw the joints turn white through the absorption of moisture. Looked real bad but still functioned. I would stick with using only one of the processes a
Electronics Forum | Tue Apr 23 17:18:54 EDT 2019 | laserpro
Hi Dave, Thanks a lot for your reply. After doing some process work on a Laser Etching machine it was brought to my attention by a colleague that if the solder mask was being penetrated fully, we could be at risk for absorption of moisture leading
Electronics Forum | Fri Jun 18 12:11:20 EDT 1999 | John Thorup
| A user of one of our components exceeded the floor life of some plastic BGA components. They did do a pre-bake prior to SMT reflow but only 72 hrs at 40C and not the recommended 12 hours at 125C. I've recommended accoustic microscopy to look for po
Electronics Forum | Thu Nov 19 16:24:23 EST 1998 | Earl Moon
| Hello Everybody | | I am new to the electronics packaging arena, please be patient with me... I have a few questions regarding the various passivation used on the silicon dice. I would really appreciate if you guys could provide me with more info
Electronics Forum | Sat Mar 29 08:38:28 EST 2003 | davef
Iman When you talk about your profile, can we assume you're measuring it on the pads of LGA? Profile the solder paste reflow by placing a thermal couple under the component pad, similar to a BGA. On a slight tangent, as with soldering BGA, paste
Electronics Forum | Tue Nov 29 12:53:56 EST 2005 | bschreiber
Hello Billy, You are correct when you say that you may want to look at the detergent (chemistry) you're adding to the stencil wash. However, "geared for epoxy removal" depends on how the chemistry is designed to remove the epoxy. If it is a "water
Electronics Forum | Mon Jan 12 14:07:53 EST 1998 | Yves Trudell
I've heard of a series of labels that absorb moisture at different rates and/or change appearance when a specific saturation level is reached. If such labels exist and if they could be correlated to the exposure limits of specific moisture sensitivit
