Used SMT Equipment | In-Circuit Testers
Fujikura FSM-60S FSM-60S Fusion Splicer Kit (with cleaver) - The FSM60S fusion splicer sets the standard for core alignment fusion splicing by incorporating a user-friendly interface with enhanced features to provide the most rugged and reliable
New Equipment | Coating Materials
High Reliability protective coatings for Electronics circuit assembly.Qualified under UL,IPC,MIL qualifications.Protection against Moisture,Humidity,Chemicals,Gases,Dust,Insects,Rodent refuse and many other pollutants. Used extensively in the Automo
As the first commercially available adhesive to address the emerging surface-mount market in the 1980s, Loctite Chip bonder and Eccobond products today are the industry standard for mixed-technology and double-sided surface mount technology (SMT) app
Industry News | 2021-10-28 22:06:34.0
In the past few months, we made a big upgrade for the new version of Lora soil moisture. In this article, we will introduce the great improvements on Makerfabs Lora Soil Moisture sensor V3!
Industry Directory | Manufacturer
Since 1984 SJE has been supplying manufacturers with a comprehensive line of ERC High Precision Capacitors and Aluminum Electrolytic Capacitors for all types of applications.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer / Other
W-Tech Ltd., based in St Jean de Soudain (between Lyon and Grenoble Isère 38) is specialized in the distribution of equipment and consumables for the electronics Professional industry.
Industry Directory | Consultant / Service Provider / Manufacturer
We supply ceramic PCB and substrates for the electronics industry. Applications include LED lighting, laser, high power switches, battery management, antennas, moisture & other outdoor sensors and much more.
Used SMT Equipment | Soldering - Wave
this type can be added with nitrogen protection system 1 Flux spraying system 1.1 Spray fluxer can sense the board size automatically, and the spraying area can be adjusted according to the width of PCB. 1.2 Spray fluxer can sense the conveyor
Technical Library | 2022-12-19 18:59:51.0
Material and Process Characterization studies can be used to quantify the harmful effects that might arise from solder flux and other process residues left on external surfaces after soldering. Residues present on an electronic assembly can cause unwanted electrochemical reactions leading to intermittent performance and total failure. Components with terminations that extend underneath the package can trap flux residue. These bottom terminated components are flush with the bottom of the device and can have small solderable terminations located along the perimeter sides of the package. The clearance between power and ground render high electrical forces, which can propagate electrochemical interactions when exposed to atmospheric moisture (harsh environments). The purpose of this research is to predict and understand the functional performance of residues present under single row QFN component packages. The objective of the research study is to develop and collect a set of guidelines for understanding the relationship between ionic contamination and electrical performance of a BTC component when exposed to atmospheric moisture and the trade-offs between electrical, ionic contamination levels, and cleanliness. Utilizing the knowledge gained from undertaking the testing of QFN components and associated DOE, the team will establish a reference Test Suite and Test Spec for cleanliness.
New Equipment | Board Handling - Storage
Ideal solution to dry, bake, store & test Moisture Sensitive Devices Drying & Storage of Moisture Sensitive Devices is getting more and more important. With reliable design and leading specifications, X-Treme Series Auto Dry Cabinets are suitable f
