Full Site - : moisture related test failures (Page 9 of 72)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

IPC Releases IPC-6012EM, Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards

Industry News | 2020-10-04 15:08:41.0

IPC is known for developing addendums to some of its most widely used standards for specific industry sector use, including military/aerospace, space flight, automotive and telecommunications. Now, IPC has responded to requests from the medical device segment of the electronics industry and has released IPC-6012EM,Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

International Counterfeit Electronics & Materials Symposium and Workshop 14th & 15th of March 2023

Industry News | 2022-12-07 07:35:10.0

The Anti-Counterfeiting Forum, CALCE and SMTA are very pleased to announce that they will be jointly hosting the Counterfeit Electronics and Materials Symposium at the Manufacturing Technology Centre in Coventry, UK, on 14th and 15th March 2023. This international event will feature domain expert speakers from Europe and USA and builds on the history of past events held in the USA by SMTA and CALCE and by the Anti-Counterfeiting Forum in the UK.

Surface Mount Technology Association (SMTA)

SMTA ANNUAL AWARDS ANNOUNCED

Industry News | 2008-09-21 02:27:24.0

Minneapolis, MN � During the Annual Meeting at SMTA International, August 20 at Disney's Coronado Springs Resort and Convention Center in Orlando, FL, the SMTA honored members who have shown exceptional service to the association and the industry.

Surface Mount Technology Association (SMTA)

Comparison of ROSE, C3/IC, and SIR as an effective cleanliness verification test for post soldered PCBA

Technical Library | 2023-04-17 21:17:59.0

The purpose of this paper is to evaluate and compare the effectiveness and sensitivity of different cleanliness verification tests for post soldered printed circuit board assemblies (PCBAs) to provide an understanding of current industry practice for ionic contamination detection limits. Design/methodology/approach – PCBAs were subjected to different flux residue cleaning dwell times and cleanliness levels were verified with resistivity of solvent extract, critical cleanliness control (C3) test, and ion chromatography analyses to provide results capable of differentiating different sensitivity levels for each test. Findings – This study provides an understanding of current industry practice for ionic contamination detection using verification tests with different detection sensitivity levels. Some of the available cleanliness monitoring systems, particularly at critical areas of circuitry that are prone to product failure and residue entrapment, may have been overlooked. Research limitations/implications – Only Sn/Pb, clean type flux residue was evaluated. Thus, the current study was not an all encompassing project that is representative of other chemistry-based flux residues. Practical implications – The paper provides a reference that can be used to determine the most suitable and effective verification test for the detection of ionic contamination on PCBAs. Originality/value – Flux residue-related problems have long existed in the industry. The findings presented in this paper give a basic understanding to PCBA manufacturers when they are trying to choose the most suitable and effective verification test for the detection of ionic contamination on their products. Hence, the negative impact of flux residue on the respective product's long-term reliability and performance can be minimized and monitored effectively.

Jabil Circuit, Inc.

Digitaltest to announce their FAQ (Fast, Accurate, Quality) suite of test and quality management solutions for high reliability products at IPC APEX 2015.

Industry News | 2015-02-17 10:38:29.0

At IPC APEX 2015 Digitaltest are showing the integration of all test processes to accurately locate defects, increase fault coverage, provide the focus to improve your process and increase quality.

Digitaltest Inc.

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

Electrical Overstress in Manufacturing and Test

Training Courses | | | ESD Control Training Courses

Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.

EOS/ESD Association, Inc.

Moisture Absorption Properties of Laminates Used in Chip Packaging Applications

Technical Library | 2020-11-29 22:06:45.0

Plastic laminates are increasingly used as interposers within chip packaging applications. As a component within the package, the laminate is subjected to package moisture sensitivity testing. The moisture requirements of chip packaging laminates are related to ambient moisture absorption and thermal cycling. Printed wiring board (PWB) laminates, however, are gauged on properties relating to wet processes such as resist developing, copper etching, and pumice scrubbing. Consequently, printed wiring board moisture absorption test methods differ from chip packaging test conditions.

Isola Group


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