Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte
| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc
Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied
Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar
Electronics Forum | Sat Jun 05 00:27:54 EDT 1999 | Dean
| | | To you all for comment and summary, | | | | | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | | | | | 1) A good set of design rules | | | 2) A good set of
Electronics Forum | Sun Oct 20 23:22:27 EDT 2002 | Hi TECH
Hi all, > > I am doing some research on SMT > machines. I would like as many people as possible > to rate the following machines 1-5. The number 1 > would be the best, number 5, the least desirable > of the 5. I realize that there are dozens of
Electronics Forum | Thu Apr 15 12:58:59 EDT 1999 | Chrys Shea
| | Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | | | I consider "fines" individual unmelted metal spheres that are foun
Electronics Forum | Sun Apr 25 11:50:08 EDT 1999 | Earl Moon
| | | We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are u
Electronics Forum | Thu Mar 15 08:16:28 EST 2001 | davef
In a similar conversation ... Alex Krstic, NovAtel Inc. said ... Hello all. We recently received some boards with some of the chip resistors placed with their resistive elements towards the board. J-STD-001B and C view this as violation for both Cl
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen
Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,
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