Full Site - : mpm any recent considered (Page 12 of 21)

Solder Paste Inspection System.

Electronics Forum | Mon Mar 11 13:11:00 EST 2002 | steve_arneson

I have read all of the previous threads and have found it very hard to believe what I am hearing. The idea that AOI is not needed on your production line is like running a marathon without training before hand. You can only expect to get out of an

Re: Solder FINES vs. Solder Balls

Electronics Forum | Wed Apr 14 17:39:20 EDT 1999 | Dave F

| Can someone explain the difference between solder "fines" and solder balls? Is there an official specification where "fines" are defined? What is the spec for "fines"? | | I consider "fines" individual unmelted metal spheres that are found in s

Substrate Au/Ni thickness

Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef

Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat

Re: Reflow oven feedback

Electronics Forum | Thu Mar 05 16:54:53 EST 1998 | Brian Stumm @ ETS, LLC

Not sure if you are open to looking at additional vendors but if you are we would love to compete for your business. Go to our web site then call or e-mail me for additional information. Sincerely, Brian Stumm Thermal processing consultant Reflow an

Re: Board Warp And Twist

Electronics Forum | Thu Aug 10 13:12:10 EDT 2000 | Bob Willis

You may care to review the following from my Circuits Assembly page on line. "HOW FLAT IS FLAT AND DO WE NEED FLAT CIRCUIT BOARD, YES WE DO ? As production problems go there is one that keeps reoccurring time and time again. The blame is usually di

Adopting CIM Software

Electronics Forum | Mon Jan 22 14:36:10 EST 2001 | aiscorp

Traditional client-server type CIM systems have required rather heavy IT support, and therefore many companies evaluating CIM systems are understandably concerned about the cost associated with this support. Recent technology advances have radically

VOC-free fluxes

Electronics Forum | Wed Oct 13 04:30:01 EDT 1999 | Brian

Hi! I recently remarked on a thread that so-called VOC-free fluxes weren't. As a result, I got three private e-mails asking what I meant. As this seems to be unclear, I'm starting a new thread with my explanation, rather than sending out the answers

Re: Component Packaging Trends

Electronics Forum | Fri Oct 16 16:11:52 EDT 1998 | Joe Belmonte

| | Hi Folks, | | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your proc

BGA rework and inspection

Electronics Forum | Thu May 30 10:31:03 EDT 2002 | robbied

Hi Yannick. This is an issue that we are just recently getting into but here is some ifo that I have gathered so far. I have seen/ used 2 different rework machines. The one we have bought is a 'PACE TF2000' which was at the lower cost end of the mar

Re: Things I Like Without Endorsing

Electronics Forum | Sat Jun 05 00:27:54 EDT 1999 | Dean

| | | To you all for comment and summary, | | | | | | The following things I like without endorsing (PCB/PCBA stuff - outside the great women in my life [many] and without [mostly]): | | | | | | 1) A good set of design rules | | | 2) A good set of


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