Electronics Forum | Mon Feb 01 15:18:58 EST 1999 | doug clement
| | My company recently purchased 3 new Phillips CSM machines and is interested in buying a Screen Printer. The one problem we have is that we have to change setups three to four times a day. Due to the small runs of one type of boards that we do.
Electronics Forum | Tue Nov 25 18:39:59 EST 2014 | rhcriad
We have an MPM UP2000 stencil printer and have a lot of issues with burned out 6410 driver cards (or driver cards just failing to work). I have looked over these threads and found that this is a common issue with these cards. I understand that thes
Electronics Forum | Thu Jun 23 21:04:04 EDT 2005 | darby
If you have concluded that it is not a file storage problem you may wish to consider - When setting up a job the camera can move to virtually any position. This does not mean that the actuators on the stencil or board have enough travel to align the
Electronics Forum | Wed Apr 21 17:11:05 EDT 1999 | Earl Moon
| Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proces
Electronics Forum | Wed Apr 21 19:09:10 EDT 1999 | Earl Moon
| | Does anyone have any experience with soldering 50mil pitch BGA's that have a via in the pad, the size is .012 The via will be masked off on the bottom side of the board. Need to know what precautions or problems if any I might encounter. The proc
Electronics Forum | Wed Mar 17 17:14:49 EST 1999 | Michael Allen
Another test to consider is dye penetrant analysis. The technique involves flooding the area beneath the soldered part with dye (preferably a bright color, like red). After drying the board+dye in an oven, you peel or torque the part off and inspec
Electronics Forum | Wed Jul 21 11:49:24 EDT 1999 | Deon Nungaray
| | | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk
Electronics Forum | Wed Dec 29 14:30:28 EST 1999 | Dan Woodward
I am not sure if I have seen an article comparing solder joint strength Vs pressfit although I am sure this has been researched by literally hundreds of companies before they felt comfortable going to pressfit. I know one of the issues with solder is
Electronics Forum | Mon Sep 14 23:21:06 EDT 2015 | solderotter
Hi there. We’re Solder Otter, a team of recent engineering graduates from the University of Waterloo in Canada that is redesigning the soldering iron so soldering electronics can be safer and simpler. You may have seen the survey we posted back in 2
Electronics Forum | Thu Mar 21 09:23:35 EDT 2024 | alishakihn
Good morning! I'm sorry to hear about the anomalies you're experiencing with your inline wash. Dealing with foaming issues can be challenging, but I'll do my best to provide some suggestions to help you troubleshoot the problem. 1. Check the Water Q
