Industry Directory | Manufacturer
Circuit Industries - PCB printed circuit board manufacturer in Thailand making high quality single sided, double sided, plated through hole with quickturn, low cost, & fast delivery. Product Catagories: prototypes, samples, and mass production (volume)
We are electronic contract manufacture and we also have JIT facility. Our head office located in Markham, Ontario, Canada. We do have a facility in USA, MEXICO and BRAZIL.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
Electronics Forum | Thu Jun 22 03:27:08 EDT 2006 | dman97
Hi everyone, I was wondering if anyone knew of a backdoor setting in these machines that will allow you to change the machine configuration. At my company, we have one operator who decided it would be nice to lock everyone out of the user menus. He
Electronics Forum | Thu Jun 22 10:22:28 EDT 2006 | PWH
I've done this stuff on UP3000's and AP's so hopefully my advice will help with your 2000... You can get into all upper level user modes, correct? You don't mention test, cal. or field service mode. If you can't get into those, I can send you a pr
Used SMT Equipment | Screen Printers
MPM, Screen Printer, type UP 2000/B , s.n. 22256, size Approx 1,17 x 1,60 x 1,50 meters , max plate 20' x20', with CRT monitor and internal PC, CE Marked
Used SMT Equipment | Screen Printers
MPM Momentum+ Printer Substrate treatment Maximum plate size(XxY) 609.6 mm x 508 mm(24”x 20”) Segmented mode-Momentum Elite 457 mm x 508 mm(18"x20") Minimum Plate Size (XxY)
Industry News | 2003-02-18 08:52:21.0
Placed Another Order for an ELX6146 High-speed Emma Test System from Viking Test Services
Industry News | 2012-08-10 14:08:21.0
Count On Tools Inc introduces the new ezLOAD PCB Support System for MPM SPM Screen Printers.
Parts & Supplies | SMT Equipment
Momentum folder side of MPM 1016013/14-04 Product Name: MPM momentum folder side 1016013/14-04 Part Number :1016013-04; 1016014-04 Description: MPM momentum folder side 1016013-04; 1016014-04 Applicable models: momentum; 125 MPM fold
Parts & Supplies | SMT Equipment
Folder side (1016013-04) of MOMENTUM 125 Name :1016013-04 folder side, MPM MOMENTUM; 125 Part Number :1016013-04; Clamper 3.5mm Description :1016013-04 folder side, MPM MOMENTUM; 125 Applicable models: MOMENTUM series; 125 1016013-04
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Precision Dispensing System for Heated Dispense Applications The GPD Global MAX II is a compact; high-accuracy system designed for today’s advanced heated dispensing applications. The frame is molded from “liquid rock” which gives the system a stabl
MPM Printer: EdgeLoc™ uses software-controlled pressure for optimal board holding force, automatically adapts to the programmed board thickness, and firmly holds the board without the use of top clamps for optimum accuracy and repeatability.
Training Courses | | | IPC-6012 Specialist (CIS)
The Certified IPC-6012 Specialist (CIS) training covers design, fabrication and inspection of rigid printed boards.
Training Courses | | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Wed Sep 11 00:00:00 EDT 2024 - Wed Sep 11 00:00:00 EDT 2024 | San Diego, California USA
San Diego Chapter In-Person Event: Reclaiming Precious Metal from SMT Scrap
Career Center | Dana Point, California USA | Sales/Marketing
We are currently seeking sales reps nationwide for this rapidly growing supplier of printed circuit boards (since 1986)with facilities in southern CA and eight PCB facilities in China and Taiwan, all ISO 9002 certified and UL94V-0 approved, some are
Career Center | Fredericksburg, Virginia USA | Engineering,Maintenance,Management,Production,Quality Control
• Certified CP643 Loader Calibration – FUJI American Chicago, IL 2001. • Certified - Cookson Performance Solutions BTU - PARAGON - P150 Oven – Maintenance & Electrical Troubleshooting Charlotte, NC 2001. • Certified UNIVERSAL (GSM) Platform: Operat
KingFei SMT Tech | http://www.smtspare-parts.com/sale-10597805-ke2020-pulley-left-side-for-e20317290a0-yb-pulley-bracket-r-asm.html
KE2020 Pulley Left Side for E20317290A0 YB Pulley Bracket R ASM Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/fr-fr/products/efd-products/side-x-side-two-component-cartridges
d'équipements Demander un devis Assistance technique Annuaire mondial Aperçu Nos cartouches Side x Side sont dotées d'une conception robuste en une seule pièce qui
