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Re: Process Control (Stencil Printer)

Electronics Forum | Tue Jan 12 14:59:14 EST 1999 | Earl Moon

| What would be a good metric for process control of a stencil printer? (fully automatic, vision equipped, stendil printer). | I'm doing some more DEK 265 GSX's with everything imaginable hung on them. Have done Lt's and the MPM2000. This makes mach

Printing SPC

Electronics Forum | Fri Sep 06 11:58:21 EDT 2002 | Brian W.

The most effective method is to monitor both printing results and parameters. Periodically (maybe once per month), run QCCalc or another program to measure the machine's capability to hold its set parameters. I also run control charts on the paste h

Printers!

Electronics Forum | Thu Mar 22 10:07:48 EDT 2012 | hussman

We chose the MPM over the DEK. We did real world comparison in our factory with both machines almost side by side last year. MPMs offer a real windows based software that basically takes the operator out of the equation. Besides the basic screen p

Re: Set-up times

Electronics Forum | Wed Oct 28 01:17:57 EST 1998 | Earl Moon

| SMT-ers | | I notice that most suppliers provide data that is eye-catching but avoid providing data of significant technical relevance, such as Cp and Cpk. It would perhaps be a wise idea for standards to be formulated in this area. | For

solder paste

Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef

Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c

Staff Process Engineer

Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control

15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience

SMT Process Engineering Specialist

Career Center | Kitchener, Ontario Canada | Engineering,Maintenance,Technical Support

Knowledgeable in Design of Experiments (DOE), Design for Manufacturability (DFM), Statistical Process Control (SPC), Failure Mode & Effects Analysis (FMEA) and Root Cause Analysis that drives continuous improvement in package reliability.  A recogniz


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