Electronics Forum | Fri Apr 02 12:41:12 EDT 2010 | CL
Nicolas, 4.1.2.1 and 4.1.2.2 mention the requirements for drying an MSD to resett the clock life. 4.1.2.2 states that once a component is dried, refer to 5.3 for safe storage. Under that specification is 5.3.3.2 DRY Cabinet at 5% RH- This states tha
Electronics Forum | Mon Jun 25 20:32:44 EDT 2001 | davef
You�re correct. This is a messy situation. Do not store components at the bake temperature longer than the time required to dry out the units for use in the reflow. Long storage times at elevated temperatures can cause soldering problems and the
Electronics Forum | Thu Jul 25 03:01:25 EDT 2002 | martz
We experience e-test failure due to BGA problem. The product was subjected to 40 deg.C hot air blowing on the BGA area and it works pretty well. The product then failed when the temperature became 36 deg. C as the hot air blower is withdrawn. If it
Electronics Forum | Sun Sep 11 01:25:34 EDT 2005 | Mika
I agree with prior postings, but there is no perfect yes/no answers, right (left)...? Only good questions to be answered. I think it is overkill to have an extra stencil, why do you need it? (That is if you have a proper stencil cleaning equipment).
Electronics Forum | Thu Jan 19 15:21:54 EST 2006 | GS
my experience: End '80 beg '90 we use a solution like that. Along the assembly lines, next to P&P machines we use to get dry cabinets (cheap and simple cabinet) where to put inside of SMDs (reel & trays once out of MBB ) during the waiting time from
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