MSL [NYSE:MSV] is a leading global provider of advanced electronics manufacturing services (EMS) to original equipment manufacturers (OEMs). The company has established a global network of manufacturing facilities in the world's major electronics ma
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SemiPack Services is an Electronic Manufacturing Support Service to the semiconductor industry. We specialize in providing support services to high-mix low-volume (HMLV) customers
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Electronics Forum | Wed Apr 16 02:40:57 EDT 2008 | andrzej
hello, I found on label two information about MSL level : MSL-2 - 240C MSL-3 - 260C Does it corresponds to SnPb and Pb-free ?
Electronics Forum | Mon Feb 14 16:31:00 EST 2011 | smt_guy
How did you implement or control MSL in your manufacturing?
Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Industry News | 2001-12-19 10:50:53.0
IPC has announced that Tom Newton has been named director of PWB Standards and Technology. In this position, Newton is responsible for new and existing standards in the areas of base materials and fabrication of printed circuit boards, as well as maintaining IPC involvement in new technologies in these same fields.
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JUKI 2010 2020 Y-axis motor conveyor belt 2480-3GT-25 40089224 EPV BASE ASM 40089837 XY BEAR CABLE D ASM XL 40089838 Y BEAR A CABLES ASM XL 40089839 Y BEAR B CABLES ASM XL 40089840 Y LINER BEAR A CABLE ASM XL 40089841 Y LINER BEAR B CABLE ASM X
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SMT MACHINE GENUINE Juki Spare Parts JUKI 750 760 Y CABLE BEARER ASM E2331715000 Specifications: Brand Name JUKI Y CABLE ASM Part number E2331715000 Model Ensure Test in machine confirmation Guarantee 1 month usage for machine JUKI 750 7
Technical Library | 2024-06-19 15:23:54.0
Each year the semiconductor industry routes a significant volume of devices to recycling sites for no reliability or quality rationale beyond the fact that those devices were stored on a warehouse shelf for two years. This study identifies the key risks attributed to extended storage of devices in uncontrolled indoor environments and the risk mitigation required to permit safe shelf-life extension. Component reliability was evaluated after extended storage to assure component solderability, MSL stability and die surface integrity. Packing materials were evaluated for customer use parameters as well as structural integrity and ESD properties. Results show that current packaging material (mold compound and leadframe) is sufficiently robust to protect the active integrated circuits for many decades and permit standard reflow solder assembly beyond 15 years. Standard packing materials (bags, desiccant, and humidity cards) are robust for a 32 month storage period that can be extended by repacking with fresh materials. Packing materials designed for long term storage are effective for more than five years.
A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-
A Sustainable Alternative - Humitector™ Type 2 cards are halogen-free and cobalt dichloride free. For more information on Type 2 Humidity Indicators, visit https://www.clariant.com/solutions/products/2017/10/31/00/12/humitector-type-2-nonreversible-
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. The increase in temperature has led to more damage, and more botched yields. According to Assembly Mag , for every 10-degree increase in temperature, the MSL rating degrades by one level
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/publications
EVALUATION OF MOISTURE SENSITIVE LEVEL (MSL) AND RELIABILITY OF DEVICES FOR HIGH RELIABILITY APPLICATIONS As Presented at SMTAI September 2003 EVALUATION OF LEAD-FREE SOLDER BONDS AND EFFECTS OF THE LEAD-FREE PROCESS ON DEVICES USING AMI As
