Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
Industry Directory | Consultant / Service Provider / Manufacturer
SemiPack Services is an Electronic Manufacturing Support Service to the semiconductor industry. We specialize in providing support services to high-mix low-volume (HMLV) customers
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
New Equipment | Board Handling - Storage
The Dr.Storage T40W are plug and play, fully auto dry cabinets which can bake at a stable 40℃ and maintain a consistent The T40W Baking Cabinets Series has a double wall design to ensure it maintains a stable According to J-STD-033B, using a T40W
Electronics Forum | Mon Jun 28 09:15:21 EDT 2004 | jdumont
Morning all, we have been seeing some problems with the edges of some of our BGA's curling away from the PCB after reflow. Is this possibly a moisture problem? If so what would be a good time/temp to bake them at to rectify the problem? Thanks in
Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer
Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers
Used SMT Equipment | SMT Equipment
Baking SMT on a cheap kitchen toaster oven is not difficult. You just need some patience and exploration good will. In this page you will read the manual procedure to bake SMD boards into a regular kitchen toaster oven appliance. Follows information
Used SMT Equipment | Soldering - Reflow
Despatch TDF2-52-1E Bake Oven Brand: DespatchModel: TFD2-52-1ESerial number: 194309Max Operating Temperature: 343C (650F)F.A. DUCT 7.00" DIAEXH. DUCT: 2.50" x 13.5"F.A. Damper Blade Cut to: 1.38" DIA Holes 2XEXH. Damper Blade Cut to: 11.25LGMinimum p
Industry News | 2003-02-11 08:42:41.0
To Handle Outbound Logistics Projects for OEMs and to Gain Greater Insight into Their Customers' Requirements for Global Direct-order Fulfillment
Surface Mount Technology Association (SMTA)
Parts & Supplies | SMT Equipment
4022 594 21990 402259421990 CNTRLLER ACM RLSE 4 NEW 4022 594 22500 402259422500 DIO CARD 4022 594 22510 402259422510 BITBUS CARD 5322 216 04099 532221604099 CAN PCB PCI 166/CAL 5322 252 11118 532225211118 FUSE, 5SX2310-7 9498 396 01043 9498
Parts & Supplies | SMT Equipment
4022 594 21990 CNTRLLER ACM RLSE 4 NEW 4022 594 22500 DIO CARD 4022 594 22510 BITBUS CARD 5322 216 04099 CAN PCB PCI 166/CAL 5322 252 11118 FUSE, 5SX2310-7 9498 396 01043 3 PHASE SAFETY RELAIS 5322 280 10304 EMER. RELAY PNOZ8/24VDC 5322
Technical Library | 2018-09-21 10:12:53.0
Moisture accumulates during storage and industry practice recommends specific levels of baking to avoid delamination. This paper will discuss the use of capacitance measurements to follow the absorption and desorption behaviour of moisture. The PCB design used in this work, focused on the issue of baking out moisture trapped between copper planes. The PCB was designed with different densities of plated through holes and drilled holes in external copper planes, with capacitance sensors located on the inner layers. For trapped volumes between copper planes, the distance between holes proved to be critical in affecting the desorption rate. For fully saturated PCBs, the desorption time at elevated temperatures was observed to be in the order of hundreds of hours. Finite difference diffusion modelling was carried out for moisture desorption behaviour for plated through holes and drilled holes in copper planes. A meshed copper plane was also modelled evaluating its effectiveness for assisting moisture removal and decreasing bake times. Results also showed, that in certain circumstances, regions of the PCB under copper planes initially increase in moisture during baking.
Technical Library | 2022-09-12 14:07:47.0
Unique component handling issues can arise when an assembly factory uses highly-moisture sensitive surface mount devices (SMDs). This work describes how the distribution of moisture within the molded plastic body of a SMD is an important variable for survivability. JEDEC/IPC [1] moisture level rated packages classified as Levels 4-5a are shown to require additional handling constraints beyond the typical out-of-bag exposure time tracking. Nitrogen or desiccated cabinet containment is shown as a safe and effective means for long-term storage provided the effects of prior out-of-bag exposure conditions are taken into account. Moisture diffusion analyses coupled with experimental verification studies show that time in storage is as important a variable as floor-life exposure for highly-moisture sensitive devices. Improvements in floor-life survivability can be obtained by a handling procedure that includes cyclic storage in low humidity containment. SMDs that have exceeded their floor-life limits are analyzed for proper baking schedules. Optimized baking schedules can be adopted depending on a knowledge of the exposure conditions and the moisture sensitivity level of the device.
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Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Reflow Profiling: Time Above Liquidus Reflow Profiling: Time Above Liquidus Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often
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Surface Mount Technology Association (SMTA) | https://www.smta.org/msd/msd.cfm
. The decision to bake components is strictly based on the status of the humidity indicator card when the bag is opened. 5. The clock of exposure time does not always stop when previously exposed components are returned to dry storage
