Industry Directory | Consultant / Service Provider / Manufacturer / Other
Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.
The MSL baking process at OX3 Corporation, (�MSL� stands for Moisture Sensitivity Level), is in accordance with IPC and JEDEC Standard "J-STD-033A," the joint industry standard for semiconductor handling, packing, shipping and the use of moisture/ref
Electronics Forum | Thu Sep 19 15:39:16 EDT 2019 | qanalyst1
When baking parts at 90C that require 15 hours bake time with parts that require 25 hours bake time, is it acceptable to open the oven and remove the former (15 hours) parts and then continue the 25 hours cycle for the remainder of the parts in the o
Electronics Forum | Fri Sep 20 16:41:01 EDT 2019 | qanalyst1
Thank you for the response, yes, the oven is vented. I guess I am concerned for parts with a thinner package body, so I wasn't wanting to leave them in for too long past the recommended bake times.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2011-02-26 16:00:45.0
Essemtec AG announces that its Tower Automatic Storage System simplifies logistics and increases the flexibility of production for Variosystems, an international electronics manufacturing subcontractor
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Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Reflow Profiling: Time Above Liquidus Reflow Profiling: Time Above Liquidus Despite much research and discussion on the subject of reflow profiling, many questions and a good deal of confusion still exist. What is clear is that the pains often
Imagineering, Inc. | https://www.pcbnet.com/blog/everything-you-need-to-know-about-moisture-sensitive-devices-msds/
. This results in a reduced production yield and product defects that can significantly hamper your bottom line. Moisture sensitivity is a growing problem thanks to factors such as higher reflow temperatures, reductions in package body thickness, the increased use of plastics, and manufacturing in high-humidity
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