Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
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