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Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.
All electronic hardware is susceptible to the damaging effects of moisture, temperature, and contaminants. STI understands the criticality of reliability testing and test-to-failure. Improper selection of assembly materials and manufacturing processe
Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right
Electronics Forum | Mon Nov 05 20:34:03 EST 2001 | davef
What�s the problem? There area many heat related failure mechanisms in bare boards. You can damage boards with heat several ways. A couple favorites [Don�t try this at home. Perform on a closed track by professional solders only.] are: * Put a
Electronics Forum | Sat Oct 02 03:27:52 EDT 1999 | Brian
| I am currently in the middle of a company wide war and I'm looking for data (AMMO). Here are the problems: | | 1) I am looking for anyone who has done or seen any reports on Thermal Shock to smt parts and/or via holes caused by Soldering Irons at
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Technical Library | 2007-04-18 19:23:22.0
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embrittlement processes. This is of obvious concern for products facing relatively high operating temperatures for protracted times and/or mechanical shock or strong vibrations in service.
Technical Library | 2022-09-25 20:18:33.0
Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
355nm 10W /15W High-Precision CCD FPC/PCB UV Laser Cutting Machine With Perfect CAM interface, it supports the mainstream of the drilling and milling file format; man-machine interface is friendly; optical path is sealed, and it also has stable an
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5296
. Data are reported for three distinct thermal cycling profiles, 0/100°C, -40/125°C, and -55/125°C, as characteristic life η (the number of cycles to achieve 63.2% failure) and slope ß
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
, continuous monitoring during thermal cycling. Thermal cycling was done in accordance with the IPC-9701A guideline [22]. The solder joints were monitored using an event detector set at a resistance limit of 1000 ohms. The failure data are reported as
