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Computer System Products, CSP

Industry Directory |

Since 1982 CSP has been providing copper and fiber optic cable assemblies for the OEM, CATV and telecommunications markets. We specialize in extremely complex cable assemblies. CSP is an ISO9001 company in Minneapolis, Minnesota. 1-800-4-CABLES

Koh Young Shares Inspection Solutions at the SMTA Wafer-Level Packaging Symposium12 February 2024

Industry News | 2024-01-23 15:41:10.0

Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, will be speaking at the SMTA Wafer-Level Packaging Symposium in Burlingame, California on our Multimodal Phase Shift Optics Approach to revolutionize high-speed 3D reconstruction of semiconductor and advanced packages. In the presentation will highlight how high-speed 3D reconstruction addresses the growing demand for electronic components, which necessitates fast and efficient processing. These advancements in measurement technology and AI integration have paved the way for enhanced packaging applications in the semiconductor industry.

Koh Young America, Inc.

Design and Integration of aWireless Stretchable Multimodal Sensor Network in a Composite Wing

Technical Library | 2020-10-08 00:55:22.0

This article presents the development of a stretchable sensor network with high signal-to-noise ratio and measurement accuracy for real-time distributed sensing and remote monitoring. The described sensor network was designed as an island-and-serpentine type network comprising a grid of sensor "islands" connected by interconnecting "serpentines." A novel high-yield manufacturing process was developed to fabricate networks on recyclable 4-inch wafers at a low cost. The resulting stretched sensor network has 17 distributed and functionalized sensing nodes with low tolerance and high resolution. The sensor network includes Piezoelectric (PZT), Strain Gauge(SG), and Resistive Temperature Detector (RTD) sensors. The design and development of a flexible frame with signal conditioning, data acquisition, and wireless data transmission electronics for the stretchable sensor network are also presented. The primary purpose of the frame subsystem is to convert sensor signals into meaningful data, which are displayed in real-time for an end-user to view and analyze. The challenges and demonstrated successes in developing this new system are demonstrated, including (a) developing separate signal conditioning circuitry and components for all three sensor types (b) enabling simultaneous sampling for PZT sensors for impact detection and (c)configuration of firmware/software for correct system operation. The network was expanded with an in-house developed automated stretch machine to expand it to cover the desired area. The released and stretched network was laminated into an aerospace composite wing with edge-mount electronics for signal conditioning, processing, power, and wireless communication.

Stanford University

FICS-PCB: A Multi-Modal Image Dataset for Automated Printed Circuit Board Visual Inspection

Technical Library | 2024-04-29 21:19:42.0

Over the years, computer vision and machine learning disciplines have considerably advanced the field of automated visual inspection for Printed Circuit Board (PCB-AVI) assurance. However, in practice, the capabilities and limitations of these advancements remain unknown because there are few publicly accessible datasets for PCB visual inspection and even fewer that contain images that simulate realistic application scenarios. To address this need, we propose a publicly available dataset, "FICS-PCB"1, to facilitate the development of robust methods for PCB-AVI. The proposed dataset includes challenging cases from three variable aspects: illumination, image scale, and image sensor. This dataset consists of 9,912 images of 31 PCB samples and contains 77,347 annotated components. This paper reviews the existing datasets and methodologies used for PCBAVI, discusses challenges, describes the proposed dataset, and presents baseline performances using feature engineering and deep learning methods for PCB component classification.

University of Florida

SMT TECHNICIANS (DE1032)

Career Center | Addison,Texas, Texas USA | Engineering

Responsible for the maintenenance, repair, trouble shooting, and diagnosing of a variety of SMT and Thru-Hole manufacturing equipment. Equipment consists of MPM AP 20/24/25 and UP2000 screen printers. Fuji CP3's, CP4's IP2's IP3's and GL2 placement

Advanced Communication Solutions

Spirent Smartbits LAN-3200A

Spirent Smartbits LAN-3200A

New Equipment |  

Base SX Smart Module Special Price: $3,000.00 The LAN-3200A Gigabit Ethernet full-duplex module provides two 1000Base-SX ports with a physical interface of 850 nanometer, multi-mode fiber. The LAN-3200As module provides two 1000Base-LX ports with a p

Alliance Test Equipment, Inc

Intelligent lead-free Reflow OvenT200C

Intelligent lead-free Reflow OvenT200C

New Equipment |  

A.High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labora

Beijing Technology Company

Lead-free Reflow Oven T200A

Lead-free Reflow Oven T200A

New Equipment |  

A. High precision. Multi-function. It satisfies all welding requirements of 0201 resistance and capacitance, fine spacing QFP, SOP, PLCC, BGA,CSP and so on. It meets the requirements of small batch and multimode product. It is also suitable for labor

Beijing Technology Company

Agilent 83496B

Agilent 83496B

Used SMT Equipment | General Purpose Test & Measurement

83496BMain  features Get breakthrough optical clock recovery  performance Option 101 with input and output: 9/125 m (singlemode)  to 62.5/125 m (multimode); wavelength range: 1250-1650 nm (singlemode), 750-1330  nm (multimode); minimum optical modula

Shenzhen Megatech

Koh Young Shares Revolutionary Advanced Package Inspection Solutions at the SMTA Wafer-Level Packaging Symposium in Burlingame, CA on 12 February 2024

Industry News | 2024-01-29 10:54:17.0

Koh Young Technology will be speaking at the SMTA Wafer-Level Packaging Symposium in Burlingame, California on our Multimodal Phase Shift Optics Approach to revolutionize high-speed 3D reconstruction of semiconductor and advanced packages. In the presentation will highlight how high-speed 3D reconstruction addresses the growing demand for electronic components, which necessitates fast and efficient processing. These advancements in measurement technology and AI integration have paved A machine with a computer on it Description automatically generatedthe way for enhanced packaging applications in the semiconductor industry.

Koh Young America, Inc.


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