Used SMT Equipment | In-Circuit Testers
Operating system: Windows 7 Software: Leonardo 2.3 XA Details: • 4040 Multimode SBL; STD Speed; High Accuracy ; 500x400mm (20x16") • Board locking system with PCB height compensator for SBL 100 • Automatic Tester Interface for SBL predisposed f
Used SMT Equipment | THT Equipment
Universal Instruments Multi-Mod II. Dual head. .300 20 pin DIP/ .600 40 pin DIP tooling. No socket tooling. Recently removed from production. Plenty of spare parts. Exec program and software included.
Industry News | 2008-02-07 16:13:47.0
LOGAN, UTAH � February 4, 2007 � Inovar Inc., a leading contract electronics manufacturer (CEM) dedicated to providing flexible solutions to OEMs in the fastest growing segments of the electronic industry, announces that it has expanded its capabilities with the acquisition of a new SPEA 4040 Multimode flying probe test system.
Custom designed and manufactured pigtailed and receptacled packages, multimode and singlemode, high repeatability versions, universal adaptors and standard FC, ST, SC packages.
Used SMT Equipment | THT Equipment
Broome Rebuild Low Insertion Counts EMC Workboard, PC Included 24 pin .300, 40 pin .600 tooling Will be completely checked out prior to ship Installation available
Since 1982 CSP has been providing copper and fiber optic cable assemblies for the OEM, CATV and telecommunications markets. We specialize in extremely complex cable assemblies. CSP is an ISO9001 company in Minneapolis, Minnesota. 1-800-4-CABLES
Industry News | 2024-01-23 15:41:10.0
Koh Young Technology, the leader in True3D™ measurement-based inspection solutions, will be speaking at the SMTA Wafer-Level Packaging Symposium in Burlingame, California on our Multimodal Phase Shift Optics Approach to revolutionize high-speed 3D reconstruction of semiconductor and advanced packages. In the presentation will highlight how high-speed 3D reconstruction addresses the growing demand for electronic components, which necessitates fast and efficient processing. These advancements in measurement technology and AI integration have paved the way for enhanced packaging applications in the semiconductor industry.
