Used SMT Equipment | AOI / Automated Optical Inspection
Single lane 3 position conveyor; 12" x 12" work area; 5MP camera; die bond and wire bond inspection.
Used SMT Equipment | AOI / Automated Optical Inspection
This NEW MVP AOI is available now. Here is the information on the machine: 2010 MVP Ultra 850G 3D AOI System; Manufactured in 1/2010; S/N: 8075; Includes Documentation, Fixturing, Software, Peripheral Items; Unit in Crate; Has never been placed in
Used SMT Equipment | AOI / Automated Optical Inspection
Post Print, Post Placement and Solder Inspection. Qty.48 1.4 Megapixel Images per Second 0201 Capable includes repair station PC This unit is located in the CEE facility in the Chicago area. A CEE technician will demonstrate the unit f
Used SMT Equipment | AOI / Automated Optical Inspection
includes repair station PC Post Print, Post Placement and Solder Inspection. Qty.48 1.4 Megapixel Images per Second 0201 Capable Facilities: 100-120V, 50/60Hz Dimms: 1500 lbs This unit is located in the CEE facility in the Chic
Overview of Machine Vision Product's Supra E, Ultra IV and Spectra Automated Optical Inspection Systems.
MVP’s enhanced Ultra SPI Solder Paste Inspection systems deploy our patented 3D technologies along with MVPs trusted AOI capabilities. Utilizing MVP’s patented technology, 3D Solder Paste Inspection (SPI) can be performed on paste for apertures as sm
The Ultra V is MVP’s fastest AOI system, designed for manufacturers with the need for the fastest beat rates. The Ultra V Series deploys the highest speed interfaces, computers and camera technologies to provide the fastest inspection times without
The MVP approach to 3D AOI utilizes the combination of both 2D and 3D AOI technologies bringing the advantages of high speed and superior defect coverage for complex defects. MVP’s advanced software tools are the key to taking advantage of each of th
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def