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New IPC-1758 Data Exchange Standard on Pack and Packing Materials Provides Consistency, Efficiency and Integrity to Declaration Process

Industry News | 2012-07-12 16:39:49.0

— IPC — Association Connecting Electronics Industries® has released IPC-1758, Declaration Requirements for Shipping, Pack and Packing Materials.

Association Connecting Electronics Industries (IPC)

IPC Releases Market Research Report on Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications

Industry News | 2015-05-21 19:17:53.0

IPC-- Association Connecting Electronics Industries— ® has released a new market research study, "Issues and Outlook for Lead-Free Electronics in Military and Aerospace Applications." This study examines the current and future state of lead-free usage in high-reliability applications.

Association Connecting Electronics Industries (IPC)

U.S. Electronics Manufacturers Grappling with Higher Costs from U.S. and Chinese Tariffs; U.S. Jobs and Investments at Risk

Industry News | 2019-10-23 15:26:19.0

Almost 90 percent of U.S. electronics manufacturers are troubled by the higher tariffs imposed by the United States and China on each other’s imports, and some are investing less in the United States and hiring fewer workers as a result.

Association Connecting Electronics Industries (IPC)

Updates to IPC-6012 and IPC-A-600 Released: Five Years of New Board Technologies and Processes Bring Significant Changes to Specifications.

Industry News | 2010-04-10 02:09:54.0

If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

Count On Tools Rolls Out Inline Filters and Filter Housings for MYDATA Equipment

Industry News | 2011-03-24 11:31:33.0

Count On Tools introduces MYDATA Replacement Inline Filters and Filter Housing components. Count On Tools replacement inline filters have been field tested and are proven to increase vacuum and air performance in the equipment while lasting longer than OEM versions. The new inline filters are capable of capturing particles as small as 0.1 µm.

Count On Tools, Inc.

Count On Tools to Introduce New SMT Nozzles and Consumables at SMTA International 2011

Industry News | 2011-09-19 16:00:50.0

Count On Tools will introduce its latest developments in SMT nozzles and consumables in Booth #323 at the upcoming SMTA International Conference & Exhibition

Count On Tools, Inc.

Count On Tools Rolls Out COT Placement Nozzles for 0201 and 01005 Components

Industry News | 2011-02-07 15:28:03.0

Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for 0201 and 01005 Micro-Components. By working closely with a component manufacturer and leading EMS companies, Count On Tools guarantees secure picking of all fragile micro-components and accurate placement on the circuit board.

Count On Tools, Inc.

Count On Tools to Introduce New SMT Nozzles and Consumables at APEX 2011

Industry News | 2011-03-11 14:17:49.0

Count On Tools Inc. will introduce its latest developments in SMT nozzles and consumables in Booth #1965 at the upcoming at the upcoming IPC APEX conference and exhibition, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Count On Tools, Inc.

Count On Tools Inc. to Unveil StripFeeder .mod V2 and Repair Services at SMTA International

Industry News | 2013-09-13 13:40:43.0

Count On Tools Inc. (COT)will introduce its new StripFeeder Modular (.mod) System version 2 in Booth #618 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

Count On Tools, Inc.

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2015-08-16 09:43:18.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 12th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 13-15, 2015 at the DoubleTree Airport Hotel in San Jose, California. Registration is now available online and Early Bird conference pricing is in effect until September 25, 2015, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)


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