Technical Library | 2007-04-05 13:48:50.0
Recently a large global player approached us with a problem. They needed an initial assembly solution for brand new components. Their boards and CSP specimens could not safely be soldered due to wetting problems at the solder joints.
Industry News | 2012-02-23 16:13:22.0
As electronic assemblers struggle to cope with increasingly complex packages and board designs, MYDATA reports a surge of interest in its jet printing technology. Software-controlled and stencil free, the technology is now used in 25 countries and hundreds of plants worldwide. In 2011, MYDATA’s system sales increased by 47 percent - a record year representing gains in market share for its entire SMT product line, including a strong growth for jet printing equipment.
Industry News | 2014-07-01 10:35:35.0
Today MYDATA automation AB has changed its name to Mycronic Technologies AB. The new name will unify the operations of MYDATA and parent company Mycronic AB, former Micronic Mydata AB, under a single brand.
Used SMT Equipment | In-Circuit Testers
Tektronix TLA5204B 136 Channel, 2 GHz Timing with 125 ps MagniVu Acquisition, 235 MHz State, 2 Mb Logic Analyzer TLA5000B Series logic analyzers combine debug power with simplicity and affordability The affordable TLA5000B Series logic analyze
New Equipment | Board Handling - Conveyors
MYDATA MYCRONIC Electrodesign PCB Conveyor Product name: SMT Conveyor PCB Width: 50 to 350 mm Application: SMT PCB Assembly Production Power Supply: 1 PH AC 220V 50/60Hz Product description: MYDATA MYCRONIC Electrodesign PCB Conveyor 47" long,
Industry Directory | Consultant / Service Provider
Flextronics is a global full-service supplier of a full spectrum of value-added Electronic Manufacturing Services.
Technical Library | 2009-03-25 19:23:18.0
Have you ever been asked to lead a project to fix a problem, implement a new technology or some other initiative? It can be intimidating. Just because you, yourself are a good problem-solver, doesn't mean you have the capacity or drive to work with a team to achieve a goal. Often the secret to success lies in up-front preparation. Here are ten things you can do to help assure that when the project is done, it will have the effective results your leadership team is looking for.
Industry News | 2011-11-08 15:26:45.0
MYDATA will unveil new solutions at Productronica 2011 in Munich, Germany (November 15-18, Booth A3 340) that enable its customers to boost productivity by combining higher speed with flexibility in both NPI and volume production.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
Industry Directory | Consultant / Service Provider / Manufacturer
Print perfect smt stencils with post-reflow success.
