New Equipment | Solder Paste Stencils
Laser Fab, NiPlate™, NanoCoat™. NicAlloy-XT™ stencils are the premier laser-cut stencils in the industry. Beginning life as a laser-cut stencil, followed by a secondary process utilizing Photo Stencil’s own proprietary NiPlate™ technology, which fur
Industry News | 2011-02-15 19:58:07.0
FCT Assembly will introduce new nano-coating stencil technology, along with its latest solder paste technologies, in Booth #262 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2016-02-24 15:57:12.0
Introduced to the electronics market in 2014, NanoSlic is a proprietary thermoset polymer coating that renders metals, glass and polymers hydrophobic and oleophobic for improved protection and performance. FCT has developed not only the breakthrough chemistry, but also the equipment and application process that provide a turnkey stencil coating solution, NanoSlic Gold. Though used in multiple markets (www.nanoslic.com) for various safeguarding purposes, for electronics assembly applications, NanoSlic-coated stencils dramatically improve printing performance.
Industry News | 2018-05-22 12:16:47.0
Specialized Coating Services, the industry leader in contract services of conformal coating, today announced the success of the ribbon cutting and open house of their new Billerica, MA office. In attendance was the industry press, many customers (including PVA, Chase/Humiseal from New York, and Krayden all the way from California), and even local Billerica government officials.
Industry News | 2014-12-11 17:22:23.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), continues to meet the challenges for micro materials testing with the introduction of a new test method for the evaluation of die strength by means of cantilever bending where 3 point bending is not suitable for die with a thickness of less than 50 microns.
Technical Library | 2019-08-07 22:56:45.0
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are designed to enhance the thermal and electrical performance of the component and ultimately allow the component to run more efficiently. Additionally, low voiding is important in decreasing the current path of the circuit to maximize high speed and RF performances. The demand to develop smaller, more reliable, packages has seen voiding requirements decrease below 15 percent and in some instances, below 10 percent.Earlier work has demonstrated the use of micro-fluxed solder preforms as a mechanism to reduce voiding. The current work builds upon these results to focus on developing an engineered approach to void reduction in leadless components (QFN) through increasing understanding of how processing parameters and a use of custom designed micro-fluxed preforms interact. Leveraging the use of a micro-fluxed solder preform in conjunction with low voiding solder paste, stencil design, and application knowhow are critical factors in determining voiding in QFN packages. The study presented seeks to understand the vectors that can contribute to voiding such as PCB pad finish, reflow profile, reflow atmosphere, via configuration, and ultimately solder design.A collaboration between three companies consisting of solder materials supplier, a power semiconductor supplier, and an electronic assembly manufacturer worked together for an in-depth study into the effectiveness of solder preforms at reducing voiding under some of the most prevalent bottom terminated components packages. The effects of factors such as thermal pad size, finish on PCB, preform types, stencil design, reflow profile and atmosphere, have been evaluated using lead-free SAC305 low voiding solder paste and micro-fluxed preforms. Design and manufacturing rules developed from this work will be discussed.
Industry News | 2019-05-20 19:24:04.0
Specialty Coating Systems (SCS) is pleased to host a new webinar on Wednesday, May 29 at 1 p.m. EDT. SCS’ Tim Seifert, Aerospace & Defense Market Manager, and Rakesh Kumar, Ph.D., Vice President of Technology, will present: “Robust, Lightweight Protection for Challenging Harsh Environments using Parylene Conformal Coatings”. The webinar is now open for registration at scswebinars.com.
Industry News | 2008-04-08 22:33:32.0
COLORADO SPRINGS, CO � April 2, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded a SMT VISION Award in the category of Assembly Tools for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, April 2, 2008 ceremony that took place in Las Vegas during APEX 2008.
Industry News | 2008-07-19 14:36:57.0
COLORADO SPRINGS, CO � July 16, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces that it has been awarded an Advanced Packaging Award in the category of Handling Equipment/Fixtures for its innovative Slick-Blade Squeegee Blades. The award was presented to the company during a Wednesday, July 16, 2008 ceremony that took place at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.
Industry News | 2018-09-13 17:46:51.0
Anda Technologies USA features a line of precision high-performance fluid dispensing and underfill systems. The entry-level SP-1 plasma cleaning machine from Anda is applicable for mobile phone, computer, digital printing and packaging, plastic, glass, automotive, electronic, medical, and surface activation treatment.
