New Equipment | Industrial Automation
UV Laser Marking Machine for Glass and Ceramics LM-102 Power 3W/5W Optical maser wavelength 355nm Marking range 150mm×150mm Laser module life 20000 h Product description: UV Laser Marking Machine for Glass and Ceramics LM-102 INQUIRY U
UV Laser Marking Machine for Glass and Ceramics LM-102 Power 3W/5W Optical maser wavelength 355nm Marking range 150mm×150mm Laser module life 20000 h Product description: UV Laser Marking Machine for Glass and Ceramics LM-102, Power 3W
UV Laser Marking Machine for Glass and Ceramics LM-102 Power 3W/5W Optical maser wavelength 355nm Marking range 150mm×150mm Laser module life 20000 h Product description: UV Laser Marking Machine for Glass and Ceramics LM-102, Power 3W
KIC start Thermal Profiler with 6 Channels for Reflow Oven 6 channels KIC start Thermal Profiler usage: reflow oven thermal profiler PC Connection: USB 2.0 (Std-A/Mini-B) Product description: KIC start Thermal Profiler with 6 Channels for Reflo
Industry News | 2015-11-17 12:24:20.0
November 17, 2015 -- At last week’s Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® (www.nanoslic.com). This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.
Industry News | 2023-10-31 19:19:30.0
StenTech® Inc. today announced that it received an esteemed 2023 Mexico Technology Award in the category of Screen/Stencil Printing Consumables. The award celebrates StenTech's revolutionary Advanced Nano Coating, a groundbreaking technology that sets a new benchmark for stencil performance and precision. The award was announced at a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
Industry News | 2013-04-12 13:38:39.0
FCT Assembly announces that it recently held its annual sales meeting at its Fort Collins, CO office.
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
Industry News | 2023-01-30 16:10:55.0
StenTech® Inc. received a 2023 CIRCUITS ASSEMBLY NPI Award in the category of Screen/Stencil Printing Peripherals/Consumables for its new Advanced Nano Coating. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
Industry News | 2023-11-20 14:30:54.0
StenTech® Inc. is pleased to announce that it received a 2023 GLOBAL Technology Award in the category of Stencils for its groundbreaking Advanced Nano Coating. The award ceremony took place during productronica, the world's leading trade fair for electronics development and production in Munich, Germany.
