Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
Industry News | 2013-02-20 08:38:42.0
FCT Assembly announces that it has been awarded a 2013 NPI Award in the category of Coatings/Encapsulants for its NanoSlic™ Nano Coating.
Industry News | 2013-09-13 13:53:44.0
FCT Assembly announces that it will exhibit its new NanoSlic™ stencil in Booth #410 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2013-05-07 17:59:59.0
FCT Assembly announces that it will exhibit at the upcoming SMTA Toronto Expo and Tech Forum, scheduled to take place Thursday May 16, 2013 at the Sheraton Toronto Airport Hotel & Conference Centre in Ontario. Keith Howell, Technical Director at Nihon Superior, will hold a technical presentation on nano silver replacement for high lead solders in semiconductor junctions.
Technical Library | 2017-09-28 16:36:33.0
These nano-coatings also refine the solder paste brick shape giving improved print definition. These two benefits combine to help the solder paste printing process produce an adequate amount of solder paste in the correct position on the circuit board pads. Today, stencil aperture area ratios from 0.66 down to 0.40 are commonly used and make paste printing a challenge. This paper presents data on small area ratio printing for component designs including 01005 Imperial (0402 metric) and smaller 03015 metric and 0201 metric chip components and 0.3 mm and 0.4 mm pitch micro BGAs.
Technical Library | 2017-10-26 01:18:49.0
Nano-coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include: Reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield. With several nano technologies already on the market and more likely to be introduced, how can the performance be quantified? How robust are these coatings? How can an assembler approach the ROI of these coatings? What hidden benefits or negative impacts should be considered? This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings.
Industry News | 2024-03-11 17:57:27.0
StenTech® Inc. is proud to announce that it has been honored with a prestigious CIRCUITS ASSEMBLY 2024 NPI (New Product Introduction) Award in the category of Screen/Stencil Printing Peripherals/Consumables for its groundbreaking innovation - the StenTech BluPrint™ CVD (Chemical Vapor Deposited) Surface Treatment. Engineered to elevate Surface Mount Technology (SMT) processes, this advanced coating offers a comprehensive set of benefits that collectively contribute to improved stencil performance, longevity, and the overall quality of the SMT assembly process, streamlining production.
Industry News | 2013-03-12 16:26:29.0
FCT Assembly announces that it will exhibit at the upcoming SMTA Dallas and Houston Expo & Tech Forums.
Industry News | 2016-09-28 10:06:01.0
KYZEN announces that its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner provides many user benefits.
