Industry News | 2011-06-24 18:52:10.0
Vicor Corporation, recently evaluated DEK’s award-winning Nano-ProTek stencil nano coating and has reported excellent results. On a densely populated board with multiple 0402, 0201, BGA and micro-BGA components, Nano-ProTek helped improve CpK and yield.
Industry News | 2023-10-31 18:57:08.0
Austin American Technology (AAT) is proud to announce that it has been honored with a prestigious Mexico Technology Award in the category of Cleaning Equipment. The award recognizes AAT's cutting-edge X-30 4.0 Fully Automatic Stencil, PCB & Misprint Cleaner for its outstanding innovation and performance. The announcement was made during a ceremony held on Wednesday, Oct. 25, 2023 at the SMTA Guadalajara in Mexico.
Industry News | 2011-11-08 13:50:15.0
Christopher Associates announced that it will sponsor presentations given by noted industry expert Chrys Shea on ways to improve the stencil printing process, a key factor in the profitability of a circuit assembly operation, this week at the SMTA Houston Chapter Meeting and Austin Expo & Tech Forum
Industry News | 2016-04-21 16:47:22.0
You're Invited!! MET Stencil cordially invites you to join them at ACI Technologies TECH EXPO. Bill Kunkle (Manager of Stencil Technology) from MET Stencil will be presenting on The Investigation Into Nano-Coated Stencils. The presentation will be on Wednesday the 27th at 3:00pm in the Navy conference room, and Thursday the 28th at 11:00am in the Army Conference room. Please follow the link below for the full schedule. MET will also have a booth to answer all of your stencil questions. Please visit us on the web at www.metstencil.com
Industry News | 2010-05-12 13:12:33.0
Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.
Industry News | 2020-11-24 00:27:11.0
Research on non-precious metal catalysts. Research progress of non-precious metal catalysts for proton exchange membrane fuel cells
Industry News | 2014-01-30 19:41:40.0
FCT Assembly announces that Fine Line Stencil is the sole licensee of the NanoSlic® Coating Technology.
Industry News | 2016-02-25 12:54:53.0
FCT Assembly (www.fctassembly.com), well-known in the electronics assembly industry for its Fine Line Stencil and FCT Solder divisions, will highlight its broad portfolio of printing products at IPC APEX 2016 (www.ipcapexexpo.org), as well as take part in multiple technical conference programs. From booth # 1139 over March 15 - 17, the FCT exhibit will play host to the company’s various technologies including innovative step/relief stencil capabilities, NanoSlic Gold coated stencil and newly formulated, pre-released water soluble paste, WS890.
Industry News | 2014-01-22 11:00:42.0
FCT Assembly announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world’s most advanced stencil technology for solder paste printing.
Technical Library | 2023-05-22 17:46:29.0
Over the past several years, much research has been performed and published on the benefits of stencil nano-coatings and solvent under wipes. The process improvements are evident and well-documented in terms of higher print and end-of-line yields, in improved print volume repeatability, in extended under wipe intervals, and in photographs of the stencil's PCB-seating surface under both white and UV light. But quantifying the benefits using automated Solder Paste Inspection (SPI) methods has been elusive at best. SPI results using these process enhancements typically reveal slightly lower paste transfer efficiencies and less variation in print volumes to indicate crisper print definition. However, the improvements in volume data do not fully account for the overall improvements noted elsewhere in both research and in production.
