Full Site - : nano coating for stencil (Page 25 of 33)

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro

It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they

Nano coatings ? PAPERS!!! ... We want papers!

Electronics Forum | Tue Mar 05 14:11:37 EST 2013 | davef

Here is "Compatibility Of Cleaning Agents With Nano-Coated Stencils" David Lober and Mike Bixenman, D.B.A., Kyzen Corporation: http://digital.trafalgarmedia.com/issue/46004/25

solution to design challenge (ubga, NSMD pads, heavy traces)

Electronics Forum | Fri Mar 27 03:42:17 EDT 2020 | sssamw

Did you try 0.12 or 0.1mm nano coated stencil @ 10 mil aperture? A soak time type profile with long reflow time could help.

Flux dip or solder print for CSP

Electronics Forum | Tue Jan 31 09:41:06 EST 2017 | emeto

If there is no specific quality reason, stay with paste. More processes you add, more points of failure. They don't need a lot of paste to get attached to the board. The ones I used were 8mil round apertures, so I did cut 1:1 on a 3 mil coated stenci

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Tue Apr 27 05:23:29 EDT 1999 | Earl Moon

| Dave said: | | | | So Earl, have you gone honest and haken a real job or is this a consulting project? | | | | | | TTYL | | | | | | Davebert | | | | | | | | DamnDaveBert, | | | | I know you didn't mean to insult such a sensitive one as me, bu

Re: Cleaning procedures for Entek-Plus Cu-106A

Electronics Forum | Mon Apr 26 17:45:26 EDT 1999 | Earl Moon

| | | Earl said, in essence: | | | | | | | Justin is absolutely right ... | | | | | | | | Again, Entek is not much more than a flux coating ... | | | | | | | | Metallic coatings protect best, as we all know - especially those electroplated. Those


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