Industry Directory | Manufacturer
Manufacturer of Laser cut stencils, thick film screens, large format screens. Variety of stainless steel materials and mesh, ITAR registered. Member of SMTA, IMAPS and IPC.
Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
Industry News | 2016-04-30 12:56:29.0
KYZEN announces that it has been awarded the 2016 SMT China Vision Award in the category of Cleaning Materials for its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner. The award was presented to the company on April 26, 2016 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Industry News | 2020-06-24 15:27:46.0
Austin American Technology (AAT) is pleased to offer the Mega ION® cleaning system designed for solvent based, high reliability applications requiring product cleanliness verification (IPC ROSE Testing). It is used for final clean prior to conformal coat, encapsulation or other sealing operations used to protect electronic modules.
Industry News | 2020-10-03 09:09:40.0
Austin American Technology (AAT) is pleased toannounce that it received a 2020 GLOBAL Technology Award in the category of Cleaning Equipment for its Mega ION®. The award was announced during a Virtual Awards Ceremony on Tuesday, September 29, 2020.
Industry News | 2024-03-18 12:27:24.0
Austin American Technology (AAT) and Aqua Klean Systems (AKS) are proud to announce the successful completion of their merger, creating the world's largest full-service electronics cleaning equipment manufacturer. The merger combines the strengths of both companies to provide an enhanced level of service to clients across various industries. AAT and AKS will be exhibiting together at Booth 4233 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
Industry News | 2013-12-10 12:14:34.0
Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Industry News | 2020-07-09 18:26:26.0
Austin American Technology today announced their newest machine sale to Lockheed Martin, which purchased an X30-A Vertical Format Batch Cleaning System.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
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