Technical Library | 2012-10-25 16:34:02.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. This paper will examine stencil technologies (including Laser and Electroform), Aperture Wall coatings (including Nickel-Teflon coatings and Nano-coatings), and how these parameters influence paste transfer for miniature devices with Area Ratios less than the standard recommended lower limit of .5. A matrix of print tests will be utilized to compare paste transfer and measure the effectiveness of the different stencil configurations. Area Ratios ranging from .32 to .68 will be investigated.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Industry News | 2014-05-12 16:13:16.0
Kyzen announces that it will take Malaysia by storm during NEPCON Malaysia 2014.
Industry News | 2014-05-20 17:07:54.0
Kyzen announces that Debbie Carboni will present at the SMTA Capital Chapter meeting, scheduled to take place Tuesday, June 17, 2014 at Orbital Sciences Corporation in Dulles, VA.
Technical Library | 2017-10-26 01:18:49.0
Nano-coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. Stated benefits include: Reduced underside cleaning, reduced bridging, improved solder paste release and improvements in yield. With several nano technologies already on the market and more likely to be introduced, how can the performance be quantified? How robust are these coatings? How can an assembler approach the ROI of these coatings? What hidden benefits or negative impacts should be considered? This paper will present a rigorous method for evaluating the performance and economic benefits of solder paste stencil nano-coatings.
Industry News | 2018-12-17 19:28:39.0
Aculon, Inc. announced today that Donald Cunningham has joined its team as Vice President of Sales. In this new position, Cunningham will oversee the development and implementation of Aculon’s sales strategy and business development to meet the surging demand for Aculon’s nano-enabled coatings and surface modification treatments.
Industry News | 2011-10-25 00:43:39.0
Sipad Systems partners up with K&F Electronics regional sales manager Gene Guy in northern California.
Industry News | 2016-08-19 05:00:52.0
If you have a process problem, let NPL Defect of the Month Video help you team
Industry News | 2022-02-10 16:53:40.0
The Murray Percival Company is pleased to announce that it has received the 2021 Distributor of the Year award from MicroCare.
Technical Library | 2023-05-22 16:49:42.0
Our customers' issues • Apertures are getting smaller • Paste does not release as well • Contaminates the bottom of the stencil • Increases defects / reduces yield Insufficient solder Bridging Solder balls on surface of PCB Flux residue • Requires more frequent cleaning • Reduced efficiency (wasted time) • Increased use of consumables (cost) USC fabric (use "cheap" fabric to reduce cost) Lint creates more defects Cleaning chemistries (use IPA to reduce cost) IPA breaks down flux and can create more defects
