Industry Directory | Manufacturer
Asahitec offers high precision and high quality products guaranteeing only the best in photoengraving and imaging technologies. Asahitec offers world class products without compromising on quality and is respected by customers.
Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
Industry News | 2015-10-26 19:13:49.0
KYZEN global headquarters shared details regarding its exhibit and technical offering to be revealed in Hall A4, Booth 409 at the productronica International Trade Fair, Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. KYZEN electronics manufacturing experts will showcase a suite of high precision cleaning products engineered specifically to reliably achieve today’s demanding stencil cleaning performance requirements.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Industry News | 2009-08-10 20:22:02.0
2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.
Industry News | 2023-10-23 09:57:34.0
Koh Young Technology, the leader in True3D™ measurement-based inspection solutions changed the industry over 20-years ago with its multi-projection solder paste inspection machine. The electronics manufacturing industry quickly adopted the patented technology, which is now the de facto standard SPI machine in the market. On 30 October during the SMTA Tampa Bay Technical Forum, Ray Welch, Senior Applications Engineer at Koh Young will discuss the growing importance of SPI as a process improvement tool.
Technical Library | 2013-03-12 13:25:18.0
High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils
Industry News | 2008-06-26 14:36:27.0
Building on its decades of materials deposition expertise, DEK has developed several unique advanced technology systems to enable next-generation semiconductor packaging and solar cell production processes. At the upcoming Semicon West event, scheduled for July 15 � 17 at San Francisco�s Moscone Center, DEK will display some of these latest innovations along with its new VectorGuard� Platinum stencil technology.
Industry News | 2014-05-06 10:43:05.0
Indium Corporation's Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.
Industry News | 2023-12-18 13:27:08.0
Austin American Technology (AAT) is pleased to announce special year-end pricing on its Aqua ROSE ES zero discharge batch cleaner. This limited-time offer presents an exclusive opportunity for businesses seeking cutting-edge cleaning technology at a reduced cost.
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
