Industry News | 2023-11-20 14:30:54.0
StenTech® Inc. is pleased to announce that it received a 2023 GLOBAL Technology Award in the category of Stencils for its groundbreaking Advanced Nano Coating. The award ceremony took place during productronica, the world's leading trade fair for electronics development and production in Munich, Germany.
Industry News | 2013-09-13 13:53:44.0
FCT Assembly announces that it will exhibit its new NanoSlic™ stencil in Booth #410 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2022-12-14 12:10:28.0
StenTech Inc. will introduce its new Advanced Nano Coating at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. Additionally, the company will have its complete product line of various stencils and tooling on display – Meet with the StenTech team in Booth #2150!
Industry News | 2014-08-28 11:13:11.0
FCT Assembly today announced that Field Application Engineer Tony Lentz will present paper titled “Performance Enhancing Nano Coatings: Changing the Rules of Stencil Design” at the upcoming SMTA International exhibition.
Industry News | 2023-08-29 07:23:24.0
StenTech® Inc. is excited to announce its participation at SMTA Chihuahua, taking place on Thursday, Sept. 7, 2023 at the Sheraton Chihuahua Soberano. The company will exhibit its highly acclaimed Advanced Nano Coating and showcase its complete product line of various stencils and tooling.
Industry News | 2014-08-25 16:35:50.0
FCT Assembly will exhibit in Booth #221 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
Industry News | 2013-03-12 16:26:29.0
FCT Assembly announces that it will exhibit at the upcoming SMTA Dallas and Houston Expo & Tech Forums.
Industry News | 2023-07-31 19:24:11.0
StenTech® Inc. is excited to announce its participation in the SMTA Michigan and SMTA Ohio Expos. The company will exhibit its highly acclaimed Advanced Nano Coating and showcase its complete product line of various stencils and tooling. The expos are scheduled for Tuesday, Aug. 15, 2023, at Laurel Manor in Livonia, MI, and Thursday, Aug. 17th, 2023 at the Embassy Suites by Hilton Cleveland-Rockside in Independence, Ohio.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
Technical Library | 2017-11-22 12:38:51.0
The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. We have previously described[1] an approach to very thin copper laminates of coating uniform layers of nano copper inks and converting them into conductive foils via photonic sintering with a multibulb conveyor system, which is consistent with roll-to-roll manufacturing. The copper thickness of these foils can be augmented by electroplating. Very thin copper layers enable etching fine lines in the flexible circuit. These films must adhere tenaciously to the polyimide substrate.In this paper, we investigate the factors which improve and inhibit adhesion. It was found that the ink composition, photonic sintering conditions, substrate pretreatment, and the inclusion of layers (metal and organic) intermediate between the copper and the polyimide are important.
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