Mechatronika's MD40 Liquid Dispensing System is a versatile automatic machine for dispensing solder paste, glue or virtually any viscous substances. MD40 combines mechanical accuracy with high quality pattern recognition system built into easy to u
Electronics Forum | Tue Sep 17 15:47:42 EDT 2002 | stepheno
Where I worked previously we had some boards with a couple 15 mil pitch parts. The first batch we got all had undersized pads. We had lots of bridging. We had less bridging with bigger pads. The ball size in the paste makes a bigger diffence regar
Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek
Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit
Industry News | 2016-09-11 12:12:28.0
SMTA China announces that it presented awards for seven papers at the SMTA China 10th Anniversary Reception, held on Tuesday, August 30, 2016 at Shenzhen Convention & Exhibition Center in conjunction with the NEPCON South China Show.
Industry News | 2019-11-12 13:03:48.0
Easy set-up and very low flow rates for two-component fluids result in precise, small deposits and narrow lines
Technical Library | 2017-12-27 22:52:43.0
To compensate for the insufficiency and instability of solder paste dispensing and printing that are used in the SMT production process, a noncontact solder paste jetting system driven by a piezoelectric stack based on the principle of the nozzle-needle-system is introduced in this paper, in which a miniscule gap exists between the nozzle and needle during the jetting process.
SMT Express, Volume 4, Issue No. 5 - from SMTnet.com Volume 4, Issue No. 5 Thursday, May 23, 2002 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Reflow Soldering
boards soldered with no-clean and lead-free flux tec
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
+125oC for 5800 cycles. It was observed that ENIG surface finish improves the component reliability comparing to OSP and ImAg. It is also observed that matching solder sphere with solder paste alloys improves the reliability in several cases, but a significant improvement was not observed when compared with the SAC305 solder spheres
GPD Global | https://www.gpd-global.com/pdf/dispense/Dispensing-Systems-and-Pumps-Overview.pdf
. These dispense systems are capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, LED Encapsulation, Surface Mount Adhesive, Encapsulations
