Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS
First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the
Electronics Forum | Thu Mar 31 07:56:31 EST 2005 | cn
I agree with chuck, but would like to add. 2D is a great option and helps to keep your printing process in check, it will measure the x & y coverage on the pad. It will help you determin when your stencil aps become clogged or when the bottom of your
Electronics Forum | Fri Jul 09 11:28:24 EDT 1999 | Earl Moon
| Has anybody successfully used an automated dispensing system to put solder paste dots on .5 mm pitch pads?? I need to replace some Meritec tsop sockets and I don't want to use the single site stencils for .5 mm parts. | Carol, Don't blame you f
Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris
I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog
Electronics Forum | Mon Aug 23 10:11:55 EDT 2010 | flipit
Hi, I have never been able to find an acceptable dispense process for dispensing small dots of solder paste. I currently have an auger screw automated dispense system and can not accomplish 0.010" dot sizes. In addition, stencil printing is much m
Electronics Forum | Tue Sep 24 12:58:27 EDT 2002 | dragonslayr
Although focusing on solderability may be the right answer, I wonder if you are satisfied that co-planarity is not the root cause. With random events of contact opens, this may be the case. Cleanliness of the stencil can also be a source of your pr
Electronics Forum | Thu Mar 23 10:02:09 EST 2006 | Joe
Check placement pressure. I agree with the "smushing" theory. If you can place the component with less pressure, I'd do that first. A switch to Type three paste is also a good idea, as long as your minimum aperture dimension remains at 0.009" as you
Electronics Forum | Thu Jun 21 22:04:18 EDT 2001 | davef
This is my attempt at beating the "Fuzzburg 7" translator used on the SMTnet Forum that mashes everything it sees. Below the next paragraph are three paragraphs,each with a common numering sequence, where each paragraph represents the columns of a t
Electronics Forum | Sun Sep 13 09:21:26 EDT 2009 | davef
You as, "What data is available showing the long term reliability of the intermetallics of the solder joints?" Alloy||Microstructure Sn-Pb||Lamella or globules Sn-Cu||Sn-matrix, Cu6Sn5 needles or globules Sn-Cu-Sb||Sn-matrix, cuboids of SbSn and Cu6
Electronics Forum | Fri Jun 04 16:30:10 EDT 2010 | jdm2008
I am running a cemelot 5000 and I am having trouble with the solder clogging up the needle. When the solder is removed it almost appears if it has reflowed. I am using a 22 guage needle, and the problem occurs with both type 3 and type 5 solder pas
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