Electronics Forum | Wed Nov 15 09:36:27 EST 2006 | Board House
Hi AJ, The biggest mistake in the industry today is documentation for lead free assembly required product. We are still seeing prints coming in saying Lead Free / High TG FR4. When in reality standard FR4 170 Tg. material is considered High Tg. and L
Electronics Forum | Thu May 08 12:11:30 EDT 2008 | boardhouse
Hi Wayne, I am just curious what material is being called out. Are you just specing FR4 or are you calling out a particular IPC 4101 / Some recommended laminates designed for Lead free assembly are: Isola 370HR Nelco 4000-11 or 4000-29 Iteq IT15
Imagineering, Inc. | https://www.pcbnet.com/capabilities/fabrication/materials-available/
(including Aluminum Bonding) Nelco 4000-13 160 Tg Allied 408 180 Tg Polyimide 230 Tg BT Epoxy 180 Tg Teflon Taconic Arlon Others including Flex Finishes include: Immersion Tin (Sn) Immersion Sliver (Ag) Immersion Gold (Au) ENTEK/OSP
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/industries/aerospace?con=t&page=29
Nordson SEALANT EQUIPMENT Enhance two-component material mix without lengthening the disposable mixer. 4000HS High Speed Bondtester Nordson DAGE The Nordson DAGE 4000HS bondtester is based upon the industry standard Nordson DAGE 4000 multi-purpose bondtester platform
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