Industry News | 2020-01-15 15:53:40.0
MIRTEC announces the expansion of its European Demonstration and Service Center in nearby Frankfurt, Germany. “This ambitious expansion of MIRTEC’s European ‘Center of Excellence’ will allow us to better serve our existing customers as well as effectively support increased demand for our award-winning inspection solutions throughout the extended European market (EMEA),” stated Chanwha Pak, CEO of MIRTEC Co. LTD.
Industry News | 2022-03-14 08:15:25.0
MIRTEC is pleased to announce that it awarded Techsystems Manufacturers' Representative Organization of the Year for 2021. Brian D'Amico, President of MIRTEC Corp. presented the award to Eric Baker, Sales Engineer at Techsystems, during the IPC APEX EXPO in San Diego.
Industry News | 2023-02-13 15:32:45.0
MIRTEC is pleased to announce that it awarded Bob Wons of Precision Automation & Assembly 'Manufacturers' Representative of the Year' for 2022. Brian D'Amico, President of MIRTEC Corp., presented the award to Bob Wons during the 2023 IPC APEX EXPO in San Diego, CA.
Industry News | 2003-02-26 09:07:20.0
Investments by electronics manufacturing companies of millions of dollars in software products to manage and automate supply and demand quantification have not prevented margins of error from 50% to 100%
Industry News | 2003-02-27 08:22:44.0
Circatex is to open its first satellite office in mainland Europe in France.
Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2003-04-15 08:39:15.0
Granted supplier qualification by the United States Department of Defense's Defense Supply Center Columbus (DSCC)
Industry News | 2003-04-18 08:31:57.0
Unichem to enhance its support and service for North American dry film photoresist and soldermask lamination equipment customers.
Industry News | 2003-05-02 08:49:07.0
Group to Assemble Data by Package and Technology Type