Industry News | 2003-03-10 17:51:59.0
TiNiMIGHT Technology
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Technical Library | 2008-03-31 21:35:36.0
While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C.
Industry News | 2003-04-24 09:48:13.0
Mars Pathfinder Mission Project Manager Brian Muirhead to Deliver Guest Keynote Address
Technical Library | 2009-03-27 22:22:40.0
The Sn-Ag-Cu (SAC) alloys have been considered promising replacements for the lead-containing solders for the microelectronics applications. However, due to the rigidity of the SAC alloys, compared with the Pb-containing alloys, more failures have been found in the drop and high impact applications for the portable electronic devices, such as the personal data assistant (PDA), cellular phone, notebook computer..etc
Technical Library | 2023-01-10 20:08:36.0
Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.
Parts & Supplies | Assembly Accessories
FUJI BFCA0260 SPRING (QP2) (QP2) FUJI BFCA0261 SPRING FUJI BFCA0270 LINK FUJI BFCA0290 NUT FUJI BFCA0291 NUT FUJI BFCA0300 COLLAR FUJI BFCA0320 STOPPER FUJI BFCA0420 NUT FUJI BFCA0430 REEL QP/8+12 MM FUJI BFCA0440 SPRING FUJI BFCA0470 REEL
Parts & Supplies | Assembly Accessories
Fuji NI080A NUT HEX Fuji NI082A NUT HEX Fuji NI085A NUT HEX Fuji N1091A NUT HEX Fuji NI089A NUT HEX Fuji H5172A BOLT HEX Fuji H5183A BOLT HEX Fuji 115274A BOLT HEX SOCKET Fuji H5277A BOLT HEX SOCKET Fuji H5287A BOLT HEX SOCKET Fuj
Industry News | 2014-11-10 11:34:02.0
ADLINK Technology has become a member of the Network Intelligence Alliance (NI Alliance), an industry organization created for collaboration among vendors of products and solutions based on network intelligence. Participation in the NI Alliance will help ADLINK to build and market innovative solutions for customers seeking to deliver advanced, cutting-edge switching, transcoding, and deep packet inspection solutions for communication and networking applications.
Used SMT Equipment | In-Circuit Testers
0dBm Spectral Power Density between 1520nm - 1620nm: >-42dBm/0.1nm Applicable fiber: SMF 9/125 um Operating Time approx: 3.5 hrs on NiMH AA rechargeable batteries.
