Parts & Supplies | Assembly Accessories
FUJI BFCA0260 SPRING (QP2) (QP2) FUJI BFCA0261 SPRING FUJI BFCA0270 LINK FUJI BFCA0290 NUT FUJI BFCA0291 NUT FUJI BFCA0300 COLLAR FUJI BFCA0320 STOPPER FUJI BFCA0420 NUT FUJI BFCA0430 REEL QP/8+12 MM FUJI BFCA0440 SPRING FUJI BFCA0470 REEL
This product we supply GE(General Electric company) for 50, 000 pcs per year. We can provide the best quality but the lowest price. Alloy Dimensions (mm) Thickness Width Length W-Ni-Fe 0.1-0.5 50-200 ��100 W-Ni-Cu
Used SMT Equipment | In-Circuit Testers
0dBm Spectral Power Density between 1520nm - 1620nm: >-42dBm/0.1nm Applicable fiber: SMF 9/125 um Operating Time approx: 3.5 hrs on NiMH AA rechargeable batteries.
Parts & Supplies | Assembly Accessories
Fuji NI080A NUT HEX Fuji NI082A NUT HEX Fuji NI085A NUT HEX Fuji N1091A NUT HEX Fuji NI089A NUT HEX Fuji H5172A BOLT HEX Fuji H5183A BOLT HEX Fuji 115274A BOLT HEX SOCKET Fuji H5277A BOLT HEX SOCKET Fuji H5287A BOLT HEX SOCKET Fuj
BI2-M12-AN6X-H1141 NI4-M12-AN6X-H1141 NI8-M18-AP6X-H1141 BI5-M18E-AP6X-H1141 BI10-M30-AN6X4M BI10-M30-AN6X5M BI10-M30-AN6X7M BI10-M30-AN6X／S903M BI10-M30-AN6X-H1141 BI10-M30-AP6X BI10-M30-AP6X5M NI15-M30-AP6X7M NI15-M30-AP6X／S90 NI4-M12-RD4X5M BI5-M
Industry News | 2003-03-10 17:51:59.0
TiNiMIGHT Technology
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
Parts & Supplies | Assembly Accessories
Fuji GVL3250 MANIFOLD Fuji Y3053A UNION ELBOW Fuji S1056A SILENCER Fuji H4135A BEARING Fuji N4027A SCRElf. HEX SOCKET SET Fuji WI024A WASl LOCK Fuji WI023A WASHER. L K Fuji WI022A WASHER. LOCK Fuji WI021A WASI LOCK. Fuji WI045A WASHER. FLAT
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry Directory | Manufacturer
Nihon has been a leader in soldering and brazing since 1966. Nihon manufactures SMT solder joining materials e.g. lead-free solder (SN100C:Sn-Cu-Ni-Ge etc): solder paste, solder spheres, flux cored solder wire, solder bar, etc.
