EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
Minimum line width/distance: 4mil; Minimum aperture: 0.25mm; Technique: Immerged Ni/Au+Entek; Layers and thickness: 7/L, blind hole board
Be adequated to applicated in connection with PC enclosure for grounding function. - notebook - server - desktop - RAID Structure : material : BeCu,Phosphor Bronze electroplated : naked,Au,Ni,Zn Fixed type : - Rivet Mount - Thread type Mount -
• Material: Re2Fe14B (Re: Nd, Dy, Pr) • Grades: o N30 to N52, working temperature: 80°C o N33M to N50M, working temperature: 100°C o N33H to N50H, working temperature: 120°C o N30SH to N45SH, working temperature: 150°C o N30UH to N40UH, working
Product name: Solder Bar Product code: NAP100 Alloy composition: Sn/Cu0.7/Ni0.05 Packing: ≈700g/pcs, 20kg/box MOQ: 500KG Price: Contact us for best price Features: - Quality guarantee (R.O.C Patent No.1366495) - No recycle material - Less 20
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