Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2021-08-26 11:15:20.0
MacDermid Alpha Electronics Solutions announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.
Industry News | 2015-11-10 18:02:56.0
Numerical Cloud is a new offering from Numerical Innovations allowing users the option to get all of their NI products online (on the “Cloud”) for a simple monthly subscription. Sign Up Now: http://bit.ly/29GXjT2
Industry News | 2011-01-18 12:16:31.0
Nihon Superior Co. Ltd. announces that company President Tetsuro Nishimura will present a paper titled “Recent Developments in the Application of Sn-Cu-Ni+Ge Lead-free Solder and Halogen-free Fluxes” at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Technical Library | 2008-03-31 21:35:36.0
While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C.
Fuji lfPA4110 COLLAR Fuji MPA4090 COLLAR Fuji KPA4021 HOLDER Fuji MPA4100 KEYFuji MPA5330 COLLAR Fuji S1022A CIR-CLIP Fuji MPA5262 HOLDER ROLLER Fuji MPA5224 LEVER Fuji MPA5231 BKT Fuji MPA5340 SPRING Fuji H5324A BOLT HEX SOCKET Fuji MPA202
Fuji lfPA4110 COLLAR Fuji MPA4090 COLLAR Fuji KPA4021 HOLDER Fuji MPA4100 KEYFuji MPA5330 COLLAR Fuji S1022A CIR-CLIP Fuji MPA5262 HOLDER ROLLER Fuji MPA5224 LEVER Fuji MPA5231 BKT Fuji MPA5340 SPRING Fuji H5324A BOLT HEX SOCKET Fuji MPA202
Fuji MPMOI00 JOINT Fuji H2050A PIN. SPRING Fuji MPM0122 SHAF1. SPLINE Fuji lIPM0113 PLATE Fuji MPM0130 COLLAR Fuji MPL0122 PUSHER Fuji H3187A PLATE. END Fuji MPAI083 JOINT Fuji H3191A PLATE. ENDFuji MPAI073 JOINT Fuji GP1Il795 PIN
Industry News | 2014-01-07 18:34:43.0
Nihon Superior Co. Ltd. announced that it will exhibit in EAST 3-27 at the upcoming INTERNEPCON 2014, scheduled to take place January 15-17, 2014 at the TOKYO BIG SITE in Tokyo, Japan.
New Equipment | Solder Materials
High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch
