New Equipment | Solder Materials
We offer Lead Free Solder Wire and Halogen Free Solder Wire; OEM service is available. Alloy / FLUX F4 F10 Sn/Cu v v Sn/Ag v v
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
Industry News | 2021-08-26 11:15:20.0
MacDermid Alpha Electronics Solutions announces the release of MICROFAB EVF NiBAR, a boric acid free sulfamate nickel electroplating process for semiconductor applications.
Technical Library | 2008-03-31 21:35:36.0
While the situation varies from country to country, nearly one year after the EU RoHS Directive came into force implementation of lead-free solder is progressing steadily. For lead-free soldering to be considered successful it is not sufficient just to have dealt with the challenges of mass production. It is also necessary to establish that the soldered joints produced are at least as reliable as those made with Sn-37Pb alloy. In this context "reliability" means the length of time in service that the initial functionality of the joint can be maintained. In this paper we will discuss some of the issues involved in solder joint reliability through a comparison of the properties of two alloys that are widely used for lead-free wave soldering, SAC305 (Sn-3.0Ag-0.5Cu) and the Sn, Cu, Ni, Ge alloy SN100C.
Industry News | 2015-11-10 18:02:56.0
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Fuji lfPA4110 COLLAR Fuji MPA4090 COLLAR Fuji KPA4021 HOLDER Fuji MPA4100 KEYFuji MPA5330 COLLAR Fuji S1022A CIR-CLIP Fuji MPA5262 HOLDER ROLLER Fuji MPA5224 LEVER Fuji MPA5231 BKT Fuji MPA5340 SPRING Fuji H5324A BOLT HEX SOCKET Fuji MPA202
Fuji lfPA4110 COLLAR Fuji MPA4090 COLLAR Fuji KPA4021 HOLDER Fuji MPA4100 KEYFuji MPA5330 COLLAR Fuji S1022A CIR-CLIP Fuji MPA5262 HOLDER ROLLER Fuji MPA5224 LEVER Fuji MPA5231 BKT Fuji MPA5340 SPRING Fuji H5324A BOLT HEX SOCKET Fuji MPA202
Industry News | 2011-01-18 12:16:31.0
Nihon Superior Co. Ltd. announces that company President Tetsuro Nishimura will present a paper titled “Recent Developments in the Application of Sn-Cu-Ni+Ge Lead-free Solder and Halogen-free Fluxes” at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.
Fuji MPMOI00 JOINT Fuji H2050A PIN. SPRING Fuji MPM0122 SHAF1. SPLINE Fuji lIPM0113 PLATE Fuji MPM0130 COLLAR Fuji MPL0122 PUSHER Fuji H3187A PLATE. END Fuji MPAI083 JOINT Fuji H3191A PLATE. ENDFuji MPAI073 JOINT Fuji GP1Il795 PIN
Parts & Supplies | Assembly Accessories
FUJI BFCA0260 SPRING (QP2) (QP2) FUJI BFCA0261 SPRING FUJI BFCA0270 LINK FUJI BFCA0290 NUT FUJI BFCA0291 NUT FUJI BFCA0300 COLLAR FUJI BFCA0320 STOPPER FUJI BFCA0420 NUT FUJI BFCA0430 REEL QP/8+12 MM FUJI BFCA0440 SPRING FUJI BFCA0470 REEL
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