Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 ✦Product Description✦ Brand Allen-Bradley Part Number/Catalog No. 1746-FIO4V Series SLC 500
Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 ✦Product Description✦ Brand Allen-Bradley Part Number/Catalog No. 1746-HS Series SLC 500 M
Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 ✦Product Description✦ 1746HS DISCONTINUED BY MANUFACTURER MOTION MODULE 5 VDC-0.300 A 24 VDC-0.104 A ISOLATED USER SIDE- 5 VDC-
Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 ✦Product Description✦ Manufacturer Rockwell Automation Brand Allen-Bradley Part Number/Catalog No.
Sales manager: Mac Xie Mobile: +8618020714662(Whatsapp) Email: at@mooreplc.com Skype: +8618020714662 ✦Product Description✦ Manufacturer Rockwell Automation Brand Allen-Bradley Part Number/Catalog No.
NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for
Industry News | 2011-12-30 23:35:59.0
Nihon Superior will issue a new series of guides on “Key Factors in the Selection of Lead-Free Solders.” This series is intended to address the challenges in choosing a reliable lead-free solder. The first guide in the series is titled “Reliability of Lead-Free Solder in Thermal Cycling.”
Industry News | 2009-03-06 15:54:16.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces SN100C high ductility lead-free solder provides high impact strength. A high ductility solder alloy can absorb more energy during impact than an alloy with high tensile strength but is brittle.
Industry News | 2009-11-06 17:20:54.0
Universal Instruments’ Advanced Process Lab hosted the third 2009 Advanced Research in Electronics Assembly (AREA) Consortium meeting at the Treadway Inn in Owego, NY on October 28-29. More than 75 attendees from the 29 member companies participated in the two-day event and a much larger number has signed up for subsequent webcasts of the presentations. Topics ranged from lead-free solder microstructure and reliability to environmental stress screening procedures.
Industry News | 2009-12-07 18:49:39.0
GREELEY, CO — September, 2009 - FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.’s SN100C product line, announces plans to exhibit its popular SN100C® Lead-Free Solder Paste, Bar and Wire and UltraSlic™ FG solder paste stencil in Hall A4 Stand 570 of the upcoming Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
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