Parts & Supplies | Assembly Accessories
FUJI BFCA0260 SPRING (QP2) (QP2) FUJI BFCA0261 SPRING FUJI BFCA0270 LINK FUJI BFCA0290 NUT FUJI BFCA0291 NUT FUJI BFCA0300 COLLAR FUJI BFCA0320 STOPPER FUJI BFCA0420 NUT FUJI BFCA0430 REEL QP/8+12 MM FUJI BFCA0440 SPRING FUJI BFCA0470 REEL
Industry News | 2008-03-05 22:38:31.0
OSAKA, JAPAN � March 5, 2008 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry, announces that it is contributing a paper, titled �High Impact Strength Tin-Copper Based Lead-free Solder Bump Alloys� authored by Tetsuro Nishimura, Shoichi Suenaga and Keith Sweatman, to the Technical Conference that is part of the TMS 2008 Annual Meeting and Exposition scheduled to take place March 9-13, 2008, in New Orleans, Louisiana.
Parts & Supplies | Assembly Accessories
Fuji NI080A NUT HEX Fuji NI082A NUT HEX Fuji NI085A NUT HEX Fuji N1091A NUT HEX Fuji NI089A NUT HEX Fuji H5172A BOLT HEX Fuji H5183A BOLT HEX Fuji 115274A BOLT HEX SOCKET Fuji H5277A BOLT HEX SOCKET Fuji H5287A BOLT HEX SOCKET Fuj
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
Parts & Supplies | Assembly Accessories
Fuji GVL3250 MANIFOLD Fuji Y3053A UNION ELBOW Fuji S1056A SILENCER Fuji H4135A BEARING Fuji N4027A SCRElf. HEX SOCKET SET Fuji WI024A WASl LOCK Fuji WI023A WASHER. L K Fuji WI022A WASHER. LOCK Fuji WI021A WASI LOCK. Fuji WI045A WASHER. FLAT
Sn/3.5Ag, Sn/0.7Cu, Sn/3.9Ag/0.6Cu, Sn/2.0Ag/0.7Cu (for Bar, Wire, Paste, BGA & Anode); Sn/Sb (for Bar); Sn (for Bar, Wire & Anode); Ni/Pd (for Bar, BGA & Anode); Conductive Adhesive (for Paste).
Industry News | 2010-09-02 10:54:09.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that the research it sponsored at the University of Queensland, Australia provided the basis for the paper that earned an ICEP Outstanding Paper Award.
Technical Library | 2012-12-13 21:20:05.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. We investigated the micro-void formation of solder joints after reliability tests such as preconditioning (precon) and thermal cycle (TC) by varying the thickness of Palladium (Pd) in Electroless Nickel / Electroless Palladium / Immersion Gold (ENEPIG) surface finish. We used lead-free solder of Sn-1.2Ag-0.5Cu-Ni (LF35). We found multiple micro-voids of less than 10 µm line up within or above the intermetallic compound (IMC) layer. The number of micro-voids increased with the palladium (Pd) layer thickness. Our results revealed that the micro-void formation should be related to (Pd, Ni)Sn4 phase resulted from thick Pd layer. We propose that micro-voids may form due to either entrapping of volatile gas by (Pd, Ni)Sn4 or creeping of (Pd, Ni)Sn4.
New Equipment | Solder Materials
DKL Metals offer a range of flux cored solder wires in a variety of alloy specifications including SN100C (SnCuNi), E-Qual 97TSC (SAC305), E-Qual 96TSC (SAC387), Alloy 23 (SnCu) and Alloy 28 (SnAg). A selection of our more popular products are detail
Industry News | 2008-02-11 15:49:48.0
GREELEY, CO � February 8, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.�s SN100C product line, announces the NC162 SN100C� No-Clean Flux.
