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FCT Solder to Premier NC162 SN100C No-Clean Flux at APEX 2008

Industry News | 2008-03-12 16:35:20.0

GREELEY, CO � March 2008 � FCT Solder, a division of FCT Assembly, announces that it will introduce NC162 SN100C� No-Clean Flux in booth 243 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.

FCT ASSEMBLY, INC.

Christopher Associates Debuts New Printable No-Clean Pastes from Koki to the US

Industry News | 2010-11-02 10:42:48.0

Christopher Associates today announced the US introduction of Koki’s S3X48-M500 and S3X48-M500C Printable No-Clean Lead-Free Solder Pastes. Originally designed and formulated for superior head-in-pillow performance, the pastes also exhibit exceptional wetting and printing.

Christopher Associates Inc.

Kester to Feature Lead-Free Information Center at APEX 2008

Industry News | 2008-02-29 16:42:42.0

ITASCA, IL � January 7, 2008 � Kester will provide lead-free resources, technologies and products in booth 1660 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Los Vegas.

Kester

Partner Paste - Lead-Free Solder Pastes

Partner Paste - Lead-Free Solder Pastes

New Equipment | Solder Materials

DKL Metals have recently introduced their latest generation of Partner Paste formulations which have been designed specifically for use in Lead Free soldering. These pastes all give excellent print and reflow characteristics, tack life and stencil li

DKL Metals Ltd

Fuji CP7 CP8 Plate Lifter DGQC0810

Fuji CP7 CP8 Plate Lifter DGQC0810

Parts & Supplies | Assembly Accessories

Fuji H5304A BOLT HEX SOCKET Fuji H5302A BOLT HEX SOCKET Fuji H5300A BOLT HESOCKET Fuji 1l5298A BOLT HEX SOCKET Fuji H5297A BOLT HEX SOCKET Fuji H5293A BOLT HEX SOCKET Fuji H5291A BOLT X SOCKET Fuji H5289A BOLT X SOCKET Fuji H5285A BOLT X SOCK

ZK Electronic Technology Co., Limited

Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2023-08-04 15:27:30.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2024-04-08 15:46:36.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

Nihon Superior’s Keith Sweatman to Introduce Novel Lead-Free Alloy for Elevated Temperature Service at SMTA International

Industry News | 2013-09-17 15:25:45.0

Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas.

Nihon Superior Co., Ltd.

NIHON SUPERIOR OPENS SAN DIEGO OFFICE

Industry News | 2007-11-30 00:12:31.0

OSAKA, JAPAN � November 29, 2007 � Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces the opening of the Nihon Superior USA, LLC office at 3101 Cowley Way, Unit 176 in San Diego, CA 92117.

Nihon Superior Co., Ltd.

New Dummy PB Free Formulations Qualified

Industry News | 2002-12-03 15:00:11.0

Practical Components adds new formulations

Practical Components, Inc.


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