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Nihon Superior to Present at SMTA International 2011

Industry News | 2011-10-16 00:20:48.0

Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.

Nihon Superior Co., Ltd.

Lead Free Solder Wire

Lead Free Solder Wire

New Equipment | Solder Materials

Lead Free Solder Wire can be made according to customers' need.   Alloy / FLUX R F5 F7 F11 Sn/Cu v v v v Sn/Ag

Shenmao Technology Inc.

Nihon Superior to Address Key Industry Trends, Concerns at the SMTA Ohio Valley Chapter Meeting

Industry News | 2011-05-16 16:00:12.0

Nihon Superior announces that Keith Howell, Technical Director for the Americas, will present during the SMTA Ohio Valley chapter meeting on June 3, 2011 at the Dave and Busters in Hilliard, Ohio.

Nihon Superior Co., Ltd.

FCT Assembly Introduces NL930PT Pin Probable Solder Paste

Industry News | 2010-03-22 13:14:36.0

GREELEY, CO — FCT Assembly introduces its NL930PT no-clean, lead-free, halide-free pin probable solder paste. The product is unique in that it is a clear residue paste that can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces the most cosmetically appealing solder joint available on the market.

FCT ASSEMBLY, INC.

Nihon Superior Rebrands SN100C Alloy with New Logo

Industry News | 2018-03-27 20:45:48.0

Nihon Superior Co.is pleased to introduce its new SN100C logo. The logo replaces the originally used SN100C logo and will be used worldwide to brand this important alloy. The announcement was made during the recent IPC APEX EXPO in San Diego.

Nihon Superior Co., Ltd.

eBall Lead-Free Solder Spheres

eBall Lead-Free Solder Spheres

New Equipment | Solder Materials

High Reliability Lead-Free Solder Spheres SN100C. eBall Selection: Impact Strength SN100C (Sn-Cu-Ni+Ge) Solder spheres with excellent impact strength, suitable for BGA, CSP, MCM and high density fine pitch

Nihon Superior Co., Ltd.

Universal Instruments’ APL Hosts Initial 2010 AREA Consortium Meeting

Industry News | 2010-07-29 15:10:06.0

Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.

Universal Instruments Corporation

Partner Wire - Lead Free Solder Wires

Partner Wire - Lead Free Solder Wires

New Equipment | Solder Materials

DKL Metals offer a range of flux cored solder wires in a variety of alloy specifications including SN100C (SnCuNi), E-Qual 97TSC (SAC305), E-Qual 96TSC (SAC387), Alloy 23 (SnCu) and Alloy 28 (SnAg). A selection of our more popular products are detail

DKL Metals Ltd

FCT Assembly's NL930PT Pin Probable Paste Wins a 2011 NPI Award

Industry News | 2011-04-20 20:31:30.0

FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.

FCT ASSEMBLY, INC.

FCT Solder to Showcase SN100C Solder Alloy at APEX 2008

Industry News | 2008-02-28 14:06:10.0

GREELEY, CO � February, 2008 � FCT Solder, a division of FCT Assembly, announces that it will exhibit SN100C� Lead-Free products paste in booth 243 at the upcoming APEX 2008 conference and exhibition, scheduled to take place April 1-3, 2008 in Las Vegas.

FCT ASSEMBLY, INC.


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