Industry News | 2009-12-07 18:05:13.0
Breda, Holland - Cobar BV, a member of the Balver Zinn Group, announces the launch of a whole new range of VOC-free and Low-VOC fluxes at Productronica. Being showcased in Stand 570 in Hall A4, these RoHS compliant fluxes fulfil the need for more environmental-friendly materials, maintaining excellent soldering performance. The event is scheduled to take place 10th – 13th November at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2010-04-23 21:21:38.0
Never content to rest on the laurels of its proven lead-free success, Henkel has developed and launched Multicore LF620: a new lead-free solder paste that effectively delivers on a broad range of demanding requirements, essentially offering a lead-free paste that has it all.
Industry News | 2010-07-29 15:10:06.0
Universal Instruments’ Advanced Process Lab hosted the first Advanced Research in Electronics Assembly (AREA) Consortium meeting of 2010 at the Treadway Inn in Owego, NY on June 16-17. Nearly 80 attendees from the 29 member companies participated in the two-day event, which will also be presented in subsequent webcasts. Topics ranged from thermal interface assembly to a continuing analysis of lead-free solder microstructure and reliability.
Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker
Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.
Electronics Forum | Thu Oct 12 08:46:16 EDT 2000 | T Jones
Several online PCB fabrication quote forms offer SMOBC as a surface finish along with HASL, Ni/AU, etc. How does one specifify SMOBC for traces and untented vias, and elctroless Ni/Au for smt pads? Are these processes mutually exclusive? Or can I g
Electronics Forum | Wed Mar 22 12:53:43 EST 2000 | David Spilker
Be careful if you use Ni/Au. The "black pad" phenomenum can be crippling. We moved from Ni/Au to OSP because of it. I also don't want to return to the lack of flatness of HASL.
Electronics Forum | Thu Nov 01 03:10:07 EST 2001 | Brian Sloth Bentzen
Will the gold from some Ni/Au surfaces make the solder joints appear dull and a slightly rugged on the surface ? Does anyone have any experience with this ? Thanks !
Electronics Forum | Thu Apr 18 14:00:35 EDT 2002 | Romain
Is anyone has experience on problems with press-fit on Ni/Au board finish. Connectors pins are SnPb finished. I am particulary interested by experiences or documentation in very agressive environmental conditions (avionics or space buisness) Thanks r
Electronics Forum | Tue Apr 04 12:44:08 EDT 2006 | Andrew
Anyone knows if there are some issues when you solder Silver finish components on Ni-Au finish pads with Sn/Pb/Ag solder paste (Indium)? (I must use components with silver finish) Thanks
Electronics Forum | Fri Oct 14 10:55:07 EDT 2005 | Mika
We have a simular problem with Ni/Au; especially whith pcb thickness more than 1.8mm. Note: These boards have been through reflow process also. 1.)Is there a maximum board thickness where it would be almost impossible to get a decent hole fil? 2.)Wi
