Electronics Forum | Fri Jul 16 13:33:31 EDT 1999 | Dale
We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are lo
Electronics Forum | Fri Jul 16 22:44:27 EDT 1999 | Vic Lau
| We are currently assemblying several different board type with gold plated lands with varying results. Can any of you that has successful experience in this area give me some pointers. What paste do you use? Do you use the recommended reflow pro
Electronics Forum | Tue Oct 23 09:09:27 EDT 2001 | Cemal Basaran
What is the reflow temperature you use to attach this package to your PCB.? I did extensive study on this package and compared it with other packages. I used our own Moire Interferometry, SEM, EDX studies. In my opinion the problem is TI does not man
Electronics Forum | Thu Nov 01 17:40:52 EST 2001 | davef
Listen to Wolfgang. Your dull solder connection is a process indicator. Some 63Sn / Au solder connections look grainy, depending on how your process them and the materials involved. Gold dissolving in tin forms an intermetallic compound [AuSn4] th
Electronics Forum | Mon Nov 05 04:59:59 EST 2001 | madreindeer
hi, I have found dull joint when I have done trial if boards and cooling too fast.Also with Nitrogen.Some of paste don�t like Nitrogen too much. Also I have seen this when profile is not hot enough or flux haven�t survived to liquidus point. I wou
Electronics Forum | Thu Feb 21 13:08:06 EST 2002 | vincent_f
Hello, I had recently a problem of crack between the solder ball (SnPb) and the Ni layer of the PCB pad. We use Electroless Ni/Au technology for PCB. This phenomena is amazing because the crack is very clean (straight) and it creates a space betwee
Electronics Forum | Thu Jun 20 04:41:47 EDT 2002 | redmary
thanks, but I also encounter the solderability problem. because these boards are HASL or Ni/Au finish, and we print the solder paste and reflow, the result shows the some non-wetting area. and the reliability test also proves to be bad. so the critic
Electronics Forum | Sat May 14 03:56:40 EDT 2005 | Mika
I am interested in RoHS "through-hole soldering": We have a problem with solder wetting and fillet during selective and wave soldering, with a Ni/Au PCBA!! Different fluxes has been tested, but this is really a big issue. Now; there is only a few fl
Electronics Forum | Fri Oct 14 13:12:30 EDT 2005 | Mika
Thanks Patrick, I our mixed standard HASL/RoHS production area; our customer have choosen Ni/Au plating for their RoHS boards. What You are saying (3.); is that we should be more attentive on the quality of the pcb manufactory. Even if our customer
Electronics Forum | Tue Jan 09 21:21:22 EST 2007 | behrsam
I am soldering a Germanium Window with a metalized rim to a Ni-Au plated kovar lid. The solder joint needs to be hermetic. I am using 80In solder washer shape preform, but am experiencing lots of voiding when x-rayed, although the joint is sealing.
