Industry News | 2009-04-13 16:23:27.0
ITASCA, IL � April 2009 � Kester announces that it will exhibit leading fluxes, pastes and wires at the upcoming 13th Annual Atlanta Expo, scheduled to take place Thursday, April 16, 2009 at the Gwinnett Civic Center in Duluth, GA.
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
Industry News | 2024-05-20 10:37:16.0
KYZEN is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX® MX2123 Multi-Process Power Module Cleaner.
Industry News | 2024-06-17 12:14:23.0
KYZEN is excited to announce its participation in SEMICON West 2024, taking place July 9–11 at the Moscone Center in San Francisco. KYZEN will be exhibiting in Booth 1841, where attendees will have the opportunity to learn about their latest advancements, including the spotlight product: MICRONOX® MX2123 Multi-Process Power Module Cleaner.
Industry Directory | Manufacturer
Intrinsiq Materials manufactures a variety of electronic ink, including screen-printable, and inkjetable copper ink, a silicon ink jet, and a nickel ink jet.
Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
Technical Library | 2020-11-15 21:01:24.0
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new surface finish also for enhancing and preserving solder-ability but with the advantage of eliminating Electroless Nickel from the deposit layer. This feature has become increasingly important with the increasing use of high frequeny PWB designs whereby nickel's magnetic properties are detrimental. We examine these two finishes and their respective soldering characteristics as plated and after steam aging and offer an explanation for the performance deviation.
Industry News | 2008-04-08 01:17:22.0
OSAKA, JAPAN � March 4, 2007 � Nihon Superior Co. Ltd., a supplier of advanced lead-free soldering materials to the global electronics industry announces that it is contributing a paper, �Impact Strength of Lead-free BGA Spheres,� to the 18th Shanghai International SMT High Level Conference that is part of NEPCON China 2008 which is scheduled to take place from April 8 to April 11, 2008 at Shanghai Everbright Convention and Exhibition Centre.
Industry News | 2009-03-12 18:45:55.0
OSAKA, JAPAN � March 2009 � Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces that Keith Sweatman, Nihon Superior Co. Ltd.'s Senior Technical Advisor, will present a paper titled �Hot Air Solder Levelling in the Lead-free Era� at the upcoming APEX Conference and Exhibition. The presentation will take place during Session 28, titled Surface Finishes, on Thursday, April 2, 2009 from 9-10 a.m.
Industry News | 2009-04-08 15:48:25.0
DENVER � April 2009 � Krayden, Inc., a leading distributor of engineered materials and Dow Corning's Distributor of the Year, announces that it will exhibit technologies from its industry-leading suppliers in booth 1141at the upcoming NEPCON East Exhibition and Conference, scheduled to take place April 22-23, 2009 at the Boston Convention & Exhibition Center in Boston, MA.
